ZED-F9P-Integration manual
Figure 46: RF input trace
The RF_IN trace on the top layer should be referenced to a suitable ground layer.
4.7.3.2 Vias for the ground pads
The ground pads under the ZED-F9P high precision receiver need to be grounded with vias to the
lower ground layer of the PCB. A solid ground layer fill on the top layer of the PCB is recommended.
This is shown in the figure below.
Figure 47: Top layer fill and vias
4.7.3.3 VCC pads
The VCC pads for the ZED-F9P high precision receiver must have as low impedance as possible with
large vias to the lower power layer of the PCB. The VCC pads need a large combined pad and the de-
coupling capacitors must be placed as close as possible. This is shown in the figure below.
UBX-18010802 - R08
4 Design Page 85 of 110
Early production information
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