Ublox MIA-M10Q - Page 4

MIA-M10Q-Integration manual
2.12 Protection level......................................................................................................... 51
2.12.1 Introduction.................................................................................................................................51
2.12.2 Interface.......................................................................................................................................52
2.12.3 Expected behavior..................................................................................................................... 53
2.13 Multiple GNSS assistance (MGA)....................................................................... 53
2.13.1 Authorization.............................................................................................................................. 54
2.13.2 Preserving MGA and operational data during power-off...................................................54
2.13.3 AssistNow offline.......................................................................................................................54
2.13.4 AssistNow autonomous........................................................................................................... 57
2.14 Data batching............................................................................................................ 60
2.14.1 Introduction.................................................................................................................................60
2.14.2 Setting up the data batching................................................................................................. 60
2.14.3 Retrieval....................................................................................................................................... 61
2.15 CloudLocate................................................................................................................61
2.15.1 CloudLocate measurements................................................................................................... 62
3 Hardware integration......................................................................................................... 63
3.1 Power supply.......................................................................................................................................... 63
3.1.1 VCC..................................................................................................................................................63
3.1.2 V_IO..................................................................................................................................................63
3.1.3 V_BCKP........................................................................................................................................... 63
3.1.4 Supply design examples.............................................................................................................64
3.2 Real-time clock...................................................................................................................................... 65
3.2.1 RTC using a crystal oscillator....................................................................................................65
3.2.2 RTC using an external clock...................................................................................................... 66
3.2.3 RTC not used................................................................................................................................ 66
3.3 RF interference......................................................................................................................................67
3.3.1 In-band interference.................................................................................................................... 67
3.3.2 Out-of-band interference........................................................................................................... 68
3.3.3 Spectrum analyzer.......................................................................................................................68
3.4 RF front-end...........................................................................................................................................69
3.4.1 Internal LNA modes.....................................................................................................................69
3.4.2 Out-of-band blocking immunity................................................................................................70
3.4.3 Out-of-band rejection..................................................................................................................71
3.4.4 Antenna power supply................................................................................................................ 72
3.5 Layout......................................................................................................................................................72
3.5.1 Package footprint, copper and solder mask.......................................................................... 74
4 Product handling................................................................................................................. 76
4.1 Safety...................................................................................................................................................... 76
4.1.1 ESD precautions...........................................................................................................................76
4.1.2 Safety precautions...................................................................................................................... 76
4.2 Packaging............................................................................................................................................... 77
4.2.1 Reels................................................................................................................................................77
4.2.2 Moisture sensitivity level............................................................................................................77
4.3 Soldering................................................................................................................................................. 77
Appendix.................................................................................................................................... 79
A Migration....................................................................................................................................................79
A.1 Software changes........................................................................................................................... 79
B Reference designs....................................................................................................................................80
UBX-21028173 - R01

Contents Page 4 of 89
C1-Public