2.11.2 Interface.......................................................................................................................................43
2.11.3 Expected behavior..................................................................................................................... 44
2.12 Multiple GNSS assistance (MGA)....................................................................... 44
2.12.1 Authorization.............................................................................................................................. 45
2.12.2 Preserving MGA and operational data during power-off...................................................45
2.12.3 AssistNow offline.......................................................................................................................45
2.12.4 AssistNow autonomous........................................................................................................... 48
2.13 CloudLocate................................................................................................................51
2.13.1 CloudLocate measurements................................................................................................... 51
3 Hardware integration.........................................................................................................53
3.1 Power supply..........................................................................................................................................53
3.1.1 VCC..................................................................................................................................................53
3.1.2 V_IO..................................................................................................................................................53
3.1.3 V_BCKP........................................................................................................................................... 53
3.2 RF interference......................................................................................................................................54
3.2.1 In-band interference.................................................................................................................... 54
3.2.2 Out-of-band interference........................................................................................................... 54
3.2.3 Spectrum analyzer.......................................................................................................................54
3.3 RF design................................................................................................................................................55
3.3.1 Integrated antenna......................................................................................................................55
3.3.2 RF front-end..................................................................................................................................57
3.4 Layout......................................................................................................................................................57
3.4.1 Package footprint, copper and solder mask.......................................................................... 59
4 Product handling................................................................................................................. 62
4.1 Safety...................................................................................................................................................... 62
4.1.1 ESD precautions...........................................................................................................................62
4.1.2 Safety precautions...................................................................................................................... 62
4.2 Packaging............................................................................................................................................... 63
4.2.1 Reels................................................................................................................................................63
4.2.2 Tapes...............................................................................................................................................63
4.2.3 Moisture sensitivity level............................................................................................................64
4.3 Soldering.................................................................................................................................................64
Appendix.................................................................................................................................... 67
A Migration....................................................................................................................................................67
A.1 Hardware changes.......................................................................................................................... 67
A.2 Software changes........................................................................................................................... 67
B Reference designs....................................................................................................................................69
B.1 Typical design.................................................................................................................................. 69
Related documents................................................................................................................ 70
Revision history.......................................................................................................................71
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