SAM-M10Q-Integration manual
The GND plane below the module is filled with GND vias to increase GND reference and to tie separate
ground plane areas together.
Figure 21: Example of recommended PCB layout (top layer)
Note that all the GND pads can be connected to the GND plane with airgaps, working as thermal
reliefs during the soldering process, as shown in Figure 22.
UBX-22020019 - R01
3 Hardware integration Page 58 of 72
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