SAM-M10Q-Integration manual
The temperature rises above the liquidus temperature of 217 °C. Avoid a sudden rise in temperature
as the slump of the paste could become worse.
• Limit time above 217 °C liquidus temperature: 40 – 60 s
• Peak reflow temperature: 245 °C
Cooling phase
A controlled cooling prevents negative metallurgical effects of the solder (solder becomes more
brittle) and possible mechanical tensions in the products. Controlled cooling helps to achieve bright
solder fillets with a good shape and low contact angle.
• Temperature fall rate: max 4 °C/s
To avoid falling off, the modules should be placed on the topside of the board during
soldering.
The final soldering temperature chosen at the factory depends on additional external factors such
as the choice of soldering paste, size, thickness and properties of the base board, etc. Exceeding the
maximum soldering temperature in the recommended soldering profile may permanently damage
the module.
Figure 27: Soldering profile
Modules must not be soldered with a damp heat process.
Optical inspection
After soldering the module, consider optical inspection.
Cleaning
Do not clean with water, solvent, or ultrasonic cleaner:
• Cleaning with water will lead to capillary effects where water is absorbed into the gap between
the baseboard and the module. The combination of residues of soldering flux and encapsulated
water leads to short circuits or resistor-like interconnections between neighboring pads.
• Cleaning with alcohol or other organic solvents can result in soldering flux residues flowing
underneath the module, into areas that are not accessible for post-cleaning inspections. The
solvent will also damage the sticker and the printed text.
• Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators.
UBX-22020019 - R01
4 Product handling Page 65 of 72
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