www.uctronics.com
12
I. 830 Tie Point Solderless Breadboard
This is true full size solderless breadboard! It has 2 split power buses, 10 columns, and 63
rows - with a total of 830 tie in points. All pins are spaced by a standard 0.1". The two
sets of five columns are separated by about 0.3", perfect for straddling a DIP package
over. The board accepts wire sizes in the range of 20-29AWG.
Specification:
MB-102 Breadboard:
Voltage: 300V
Current: 3A to 5A
ABS Housing
Nickle Phosphor Bronze Contact Clips
Solderless Breadboard with 830 Tie-points
Material: ABS plastic material, Phosphor bronze nickel plated spring clips
Accepts a variety of wire sizes (20-29 AWG)
Dimensions: 16.5x5.4x0.9cm
Colored coordinates for easy component placement
To Next Page
Loading...
Need help?
General