SERVICE MANUAL
HAMAMATSU, JAPAN
1.33K-257 I.T Printed in Japan 2000.05
CL 001636
CONTENTS
SPECIFICATIONS ................................................................................3
PANEL LAYOUT ..................................................................................5
CIRCUIT BOARD LAYOUT ...................................................................7
BLOCK DIAGRAM ...............................................................................9
DISASSEMBLY PROCEDURE .......................................................... 11
LSI PIN DISCRIPTION ........................................................................20
IC BLOCK DIAGRAM ......................................................................... 22
CIRCUIT BOARDS ............................................................................. 23
TEST PROGRAM............................................................................... 29
INSPECTION......................................................................................33
MIDI IMPLEMENTATION CHART ........................................................ 34
PARTS LIST (CLP-920)
PARTS LIST (CLP-930)
CIRCUIT DIAGRAM
CLP-930 CLP-920
This document is printed on chlorine free (ECF) paper with soy ink.