SERVICE MANUAL
HAMAMATSU, JAPAN
1.33K-9301 I.T Printed in Japan 2000.07
CL 001645
CONTENTS
SPECIFICATIONS .............................................................................. 3
PANEL LAYOUT.................................................................................. 5
CIRCUIT BOARD LAYOUT ................................................................. 7
BLOCK DIAGRAM .............................................................................. 8
DISASSEMBLY PROCEDURE ........................................................... 9
LSI PIN DISCRIPTION...................................................................... 17
IC BLOCK DIAGRAM........................................................................ 22
CIRCUIT BOARDS ........................................................................... 23
TEST PROGRAM ............................................................................. 28
INSPECTION .................................................................................... 31
MIDI IMPLEMENTATION CHART ..................................................... 32
PARTS LIST
CIRCUIT DIAGRAM
CLP-970 CLP-970C
This document is printed on chlorine free (ECF) paper with soy ink.
Model equipped with “A” has no floppy disk drive.
CLP-970M