Yamaha Clavinova CLP-970 User Manual

SERVICE MANUAL
HAMAMATSU, JAPAN
1.33K-9301 I.T Printed in Japan 2000.07
CL 001645
CONTENTS
SPECIFICATIONS .............................................................................. 3
PANEL LAYOUT.................................................................................. 5
CIRCUIT BOARD LAYOUT ................................................................. 7
BLOCK DIAGRAM .............................................................................. 8
DISASSEMBLY PROCEDURE ........................................................... 9
LSI PIN DISCRIPTION...................................................................... 17
IC BLOCK DIAGRAM........................................................................ 22
CIRCUIT BOARDS ........................................................................... 23
TEST PROGRAM ............................................................................. 28
INSPECTION .................................................................................... 31
MIDI IMPLEMENTATION CHART ..................................................... 32
PARTS LIST
CIRCUIT DIAGRAM
CLP-970 CLP-970C
This document is printed on chlorine free (ECF) paper with soy ink.
Model equipped with “A” has no floppy disk drive.
CLP-970M

Yamaha Clavinova CLP-970 Specifications

General

Number of Keys	88
Touch Sensitivity	Hard/Medium/Soft/Fixed
Polyphony	64
Sound Source	AWM (Advanced Wave Memory)
Effects	Reverb, Chorus, DSP
Recorder	2-track
Pedals	3 (Damper, Soft, Sostenuto)
Amplifier	40W x 2
Speakers	16cm x 2
Headphone Jacks	2
Key Action	Graded Hammer Effect
Weight	57 kg
MIDI	In/Out

Summary

SPECIFICATIONS

Model Specifications

Details for CLP-970/970M/970C and "A" models.

INTERNAL LAYOUT AND DIAGRAMS

Block Diagram

Functional block diagram illustrating system interconnections.

DISASSEMBLY AND ASSEMBLY PROCEDURES

Basic Component Disassembly

Internal Unit and Board Removal

Procedures for removing jack unit, keycover, and panel assemblies.

Component Removal and Specific Procedures

Keyboard Assembly Procedures

Detailed steps for GH keyboard disassembly and assembly.

LSI PIN DESCRIPTION

LSI Pin Description

TEST PROGRAM

Test Program Overview

Instructions and list of tests for system diagnostics.

INSPECTION PROCEDURES

AUX OUT and PHONES Inspection

Procedures for inspecting audio output levels and noise.

Noise Level Check

Procedure for checking audio output noise level.

MIDI IMPLEMENTATION CHART

MIDI Implementation Chart (Preset Sound Source)

MIDI Implementation Chart (XG Sound Source)

PARTS LIST

Parts List Overview

Main Unit Parts

Electrical Components