SERVICE MANUAL
SY 011451
HAMAMATSU,JAPAN
0.32K-5351 I Printed in Japan’98.12
CONTENTS
PANEL LAYOUT ........................................................................................3
SPECIFICATIONS .....................................................................................4
CIRCUIT BOARD LAYOUT .......................................................................6
WIRING & BLOCK DIAGRAM..................................................................7
DISASSEMBLY PROCEDURE .................................................................8
CIRCUIT BOARDS................................................................................. 11
LSI PIN DESCRIPTION .........................................................................13
IC BLOCK DIAGRAM ............................................................................15
TEST PROGRAM...................................................................................18
INITIALIZE...............................................................................................26
ERROR MESSAGES ..............................................................................28
CONNECTING CABLES ........................................................................29
MIDI IMPLEMENTATION CHART .........................................................30
PARTS LIST
OVERALL CIRCUIT DIAGRAM
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