ELECTRONIC PIANO
CONTENTS（目次）
SPECIFICATIONS（総合仕様）··············································· 3
PANEL LAYOUT（パネルレイアウト）···································· 4
DISASSEMBLY PROCEDURE（分解手順）···························· 7
LSI PIN DESCRIPTION（LSI 端子機能表）··························· 16
IC BLOCK DIAGRAM（IC ブロック図）································ 21
CIRCUIT BOARDS（シート基板図）····································· 22
TEST PROGRAM（テストプログラム）··························· 35/38
FACTORY SET（初期化）······················································ 41
MIDI IMPLEMENTATION CHART·········································· 42
MIDI DATA FORMAT ······························································ 43
PARTS LIST
OVERALL CIRCUIT DIAGRAM（総回路図）
CIRCUIT BOARD LAYOUT（ユニットレイアウト）
BLOCK DIAGRAM（ブロックダイアグラム）
This document is printed on chlorine free (ECF) paper.
HAMAMATSU, JAPAN
1.402K-3531 Printed in Japan '02.12
SY
001695
SERVICE MANUAL
20021201-248000
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