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Yamaha SPX1000 Service Manual

Yamaha SPX1000
55 pages
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Professional
Multi-Effect Processer
CONTENTS
SPECIFICATIONS
2
CIRCUIT
BOARD
LAYOUT &
WIRING
(a~
7 h h&ISIIi)
4
PANEL
LAYOUT
u
T
T’
)
6
BLOCK
DIAGRAM
(7"p
y ^ Y
7”^
7
A)
•••7
DIMENSIONS
(-Tj-iilU)
7
LSI DATA
TABLE
(LSI
8
1C
BLOCK
DIAGRAM
(1C
7'
a
y
m)
12
DISASSEMBLY
PROCEDURE
(^flf^Jill)
15
CHECKS
&
ADJUSTMENTS
18/20
MIDI DATA
FORMAT
(MIDI
-7-
7
-
v
-y
h)
22/31
DIGITAL I/O
MODE (7^'7^;n/0^- K)
••••37
INPUT MODE
(Y>7”
y
F)
38
EFFECT
MODE
(x7o:7
F)
39
MIDI
IMPLEMENTATION
CHART
40
CIRCUIT
BOARDS
('>-
I'SitSlU)
42
TEST
PROGRAM
(^7
F
7°p7
7A)
50
PARTS LIST
LM
006876
YAMAHA
CORP.
HAMAMATSU.
JAPAN
2. 85K-534
@
Printed
in Japan
88.10
OOOTXdS
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Yamaha SPX1000 Specifications

General IconGeneral
Sampling Frequency44.1 kHz
Dynamic Range90 dB
TypeMulti-Effect Processor
Frequency Response20 Hz - 20 kHz
MIDIIn, Out
Memory7 user programs
Total Harmonic Distortion + Noise0.03% (1 kHz)
Effects Programs63 programs
Effects TypesReverb, Delay, Modulation, Pitch, EQ
Power SupplyAC 120V
Dimensions (W x D x H)480 mm

Summary

SPECIFICATIONS

ELECTRICAL CHARACTERISTICS

Detailed electrical characteristics including frequency response, dynamic range, distortion.

INPUT

Specifications for input channels, level, and impedance.

A/D CONVERSION

Specifications for Analog-to-Digital conversion, sampling frequency, and quantization.

D/A CONVERSION

Specifications for Digital-to-Analog conversion, sampling frequency, and quantization.

OUTPUT

Specifications for output channels, level, and impedance.

MEMORY

Details on presets (ROM) and user memory (RAM) capacity.

MIDI CONTROL

Specifications for MIDI control messages like Program Change and Control Change.

FRONT PANEL

Details about front panel controls, keys, and display.

CONNECTORS

List of connectors and their functions on the front and rear panels.

REAR PANEL

Details about rear panel connectors and switches.

SWITCH

List of switches and their functions.

GENERAL

General specifications including power supply and dimensions.

CIRCUIT BOARD LAYOUT & WIRING

U. S. & Canadian Models

Circuit board layout and wiring diagram for US and Canadian models.

European Model

Circuit board layout and wiring diagram for the European model.

Japanese Model

Circuit board layout and wiring diagram for the Japanese model.

PANEL LAYOUT

Front Panel

Detailed layout and identification of controls on the front panel.

Rear Panel

Detailed layout and identification of connectors and controls on the rear panel.

BLOCK DIAGRAM

DIMENSIONS

LSI DATA TABLE

IC BLOCK DIAGRAM

DISASSEMBLY PROCEDURE

Removal of Top Cover

Instructions for removing the top cover of the unit.

Removal of Front Panel

Instructions for removing the front panel of the unit.

Removal of AD Circuit Board

Instructions for removing the AD circuit board.

Removal of PS Circuit Board

Instructions for removing the PS circuit board.

Removal of MT Circuit Board

Instructions for removing the MT circuit board.

Removal of FP 1/3 Circuit Board

Instructions for removing the FP 1/3 circuit board.

Removal of FP 2/3 Circuit Board

Instructions for removing the FP 2/3 circuit board.

Removal of FP 3/3 Circuit Board

Instructions for removing the FP 3/3 circuit board.

Removal of LCD Assembly

Instructions for removing the LCD assembly.

CHECKS & ADJUSTMENTS

Preparation (Connections)

Initial setup and connections required for checks and adjustments.

Adjustments

Procedures for adjusting various parameters like clipping level, gain, MSB, and offset.

Gain

Procedure for adjusting output gain levels based on switch settings.

Frequency response

Procedure for measuring and verifying frequency response.

Distortion

Procedure for measuring and verifying distortion levels.

Noise level

Procedure for measuring and verifying noise levels.

Maximum output level

Procedure for measuring maximum output level and distortion.

Channel separation

Procedure for measuring channel separation and signal leakage.

Muting circuit

Procedure for checking the muting circuit operation during power on/off.

Measuring Instruments

Specifications for measuring instruments used in checks and adjustments.

MIDI DATA FORMAT

Transmitting Conditions

Conditions for transmitting MIDI data, including channel and bulk data.

Transmitting Data

Detailed structure and format of transmitted MIDI data, including system information.

System information

Specifics of system information transmission via MIDI, including memory bulk data.

Bank Program Change Chart Bulk Data

Format for transmitting bank program change chart data via MIDI.

User ER Pattern Bulk Data

Format for transmitting user ER pattern data via MIDI.

System Setup Bulk Data

Format for transmitting system setup data via MIDI.

Receiving Conditions

Conditions for receiving MIDI data, including channel and trigger settings.

Reception Data

Details on received MIDI data, including channel voice messages and system exclusive messages.

Channel information

Interpretation of channel voice messages like Note On and Note Off.

System Information

Interpretation of system exclusive messages like bulk dump requests.

Control Change

How control change messages are received and used to control parameters.

Program Change

How program change messages are received to load programs.

Bank Change Request

Format for Bank Change Request MIDI messages to switch banks.

DIGITAL I/O MODE

Analog

Diagram illustrating analog input/output signal flow.

Pre

Diagram illustrating 'Pre' digital I/O mode signal flow.

Post

Diagram illustrating 'Post' digital I/O mode signal flow.

Digital

Diagram illustrating digital input/output signal flow.

EFFECT MODE

Single #1-30

Description of single effect modes from #1 to #30.

Multi #31-33

Description of multi-effect modes from #31 to #33.

2ch In #34-38

Description of 2-channel in effect modes from #34 to #38.

Stereo #39,40

Description of stereo effect modes #39 and #40.

MIDI Implementation Chart

TEST PROGRAM

Test Program Entry

Instructions on how to enter and start the test program.

TEST 1: LCD Check

Procedure for testing the LCD display functionality.

TEST 2: LED Check

Procedure for testing all LED indicators and segments.

TEST 3: Panel Switch Check

Procedure for checking all panel switches using foot switches.

TEST 4: FOOT VOLUME 1 Check

Procedure for checking the FOOT VOLUME 1 control.

TEST 5: FOOT VOLUME 2 Check

Procedure for checking the FOOT VOLUME 2 control.

TEST 6: Analog Trigger (LINE) Check

Procedure for checking the analog trigger input (LINE).

TEST 7: Analog Trigger (MIC) Check

Procedure for checking the analog trigger input (MIC).

TEST 8: MIDI Check

Procedure for checking MIDI IN/OUT communication.

TEST 9: AD OFFSET Adjustment

Procedure for adjusting AD offset and minimizing click noise.

TEST 10: Factory Set

Procedure for initializing the unit to factory settings.

TEST 20: DRAM Check

Procedure for checking the DRAM for DSP.

CIRCUIT BOARDS

AD Circuit Board

Component layout diagram for the AD circuit board.

FP 1/3 Circuit Board

Component layout diagram for the FP 1/3 circuit board.

FP 2/3 Circuit Board

Component layout diagram for the FP 2/3 circuit board.

FP 3/3 Circuit Board

Component layout diagram for the FP 3/3 circuit board.

MT Circuit Board

Component layout diagram for the MT circuit board.

PS Circuit Board (Japanese Model)

Component layout diagram for the Japanese PS circuit board.

PS Circuit Board (U.S. Model)

Component layout diagram for the U.S. PS circuit board.

PS Circuit Board (Canadian Model)

Component layout diagram for the Canadian PS circuit board.

PS Circuit Board (North European Model)

Component layout diagram for the North European PS circuit board.

PARTS LIST

OVERALL ASSEMBLY

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