Alienware 13 R2 User Manual

Removing the heat-sink assembly............................. 68
Prerequisites.....................................................................................................68
Procedure..........................................................................................................69
Replacing the heat-sink assembly............................... 71
Procedure........................................................................................................... 71
Post-requisites...................................................................................................71
Removing the wireless card............................................72
Prerequisites..................................................................................................... 72
Procedure.......................................................................................................... 72
Replacing the wireless card............................................ 74
Procedure.......................................................................................................... 74
Post-requisites.................................................................................................. 74
Removing the coin-cell battery.....................................75
Prerequisites..................................................................................................... 75
Procedure.......................................................................................................... 75
Replacing the coin-cell battery..................................... 77
Procedure...........................................................................................................77
Post-requisites.................................................................................................. 77
Removing the system board.......................................... 78
Prerequisites..................................................................................................... 78
Procedure.......................................................................................................... 78
Replacing the system board.......................................... 80
Procedure..........................................................................................................80
Post-requisites................................................................................................. 80
6

Alienware 13 R2 Specifications

General

Tcase	- °C
Bus type	OPI
Stepping	D1
Tjunction	100 °C
FSB Parity	No
Processor cache	4 MB
Processor cores	2
Processor model	i7-6500U
System bus rate	4 GT/s
Processor family	Intel® Core™ i7
Processor series	Intel Core i7-6500 Mobile series
Processor socket	LGA 1356 (Socket B2)
Processor threads	4
Processor codename	Skylake
Configurable TDP-up	25 W
Number of QPI links	-
Processor frequency	2.5 GHz
Processor cache type	Smart Cache
Configurable TDP-down	7.5 W
Processor lithography	14 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	3.1 GHz
Processor operating modes	64-bit
PCI Express configurations	1x4, 4x1
Thermal Design Power (TDP)	15 W
Configurable TDP-up frequency	2.6 GHz
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	12
Processor code	SR2EZ
Processor ARK ID	88194
Processor package size	42 X 24 mm
CPU configuration (max)	1
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Intel Smart Response Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00
CUDA cores	640
On-board graphics card ID	1916
Discrete graphics card model	NVIDIA® GeForce® GTX 960M
On-board graphics card model	Intel® HD Graphics 520
Discrete graphics card memory	2 GB
Discrete graphics memory type	GDDR5
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.74 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1050 MHz
Maximum internal memory (64-bit)	16 GB
Intel® Virtualization Technology (Intel® VT)	VT-x, VT-d
Form factor	Clamshell
Product type	Laptop
Product color	Black, Silver
Market positioning	Gaming
Memory slots	2x SO-DIMM
Memory clock speed	1600 MHz
Memory form factor	SO-DIMM
Internal memory type	DDR3L-SDRAM
Memory layout (slots x size)	2 x 8 GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
Storage media	SSD
Total storage capacity	256 GB
Pixel pitch	0.115 x 0.115 mm
Display surface	Matt
Display diagonal	13.3 \
Display brightness	400 cd/m²
Display resolution	3200 x 1800 pixels
Native aspect ratio	16:9
Audio system	Creative Sound Blaster X-Fi MB3
Speaker power	2 W
Speakers manufacturer	Klipsch
Video capturing speed	30 fps
Front camera resolution	1920 x 1080 pixels
Front camera resolution (numeric)	2.1 MP
Wi-Fi standards	Wi-Fi 5 (802.11ac)
Bluetooth version	4.1
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
VGA (D-Sub) ports quantity	0
Pointing device	Touchpad
Battery voltage	14.8 V
Battery capacity	51 Wh
Battery life (max)	10.5 h
Battery recharge time	4 h
AC adapter power	130 W
AC adapter frequency	50 - 60 Hz
AC adapter input voltage	100 - 240 V
AC adapter output current	6.7 A
AC adapter output voltage	19.5 V
Cable lock slot type	Noble
Operating shock	110 G
Operating altitude	-15.2 - 3048 m
Non-operating shock	160 G
Operating vibration	0.66 G
Non-operating altitude	-15.2 - 10668 m
Non-operating vibration	1.3 G
Storage temperature (T-T)	-40 - 65 °C
Operating temperature (T-T)	0 - 35 °C
Storage relative humidity (H-H)	0 - 95 %
Operating relative humidity (H-H)	10 - 90 %

Weight and Dimensions

Depth	235 mm
Width	328 mm
Weight	2058 g
Height (rear)	27.9 mm
Height (front)	26.34 mm