2
English
1.2 Specications
Platform
•
Mini-ITX Form Factor
•
Solid Capacitor design
CPU
•
Supports 13
th
Gen & 12
th
Gen Intel® Core
TM
Processors
(LGA1700)
•
Digi Power design
•
6 Power Phase design
•
Supports Intel® Hybrid Technology
•
Supports Intel® Turbo Boost Max 3.0 Technology
Chipset
•
Intel® H610
Memory
•
Dual Channel DDR4 Memory Technology
•
2 x DDR4 DIMM Slots
•
Supports DDR4 non-ECC, un-buered memory up to 3200*
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
•
Supports ECC UDIMM memory modules (operate in non-
ECC mode)
•
Max. capacity of system memory: 64GB
•
Supports Intel® Extreme Memory Prole (XMP) 2.0
Expansion
Slot
CPU:
•
1 x PCIe 4.0 x16 Slot (PCIE1), supports x16 mode*
Chipset:
•
1 x Vertical M.2 Socket (Key E), supports type 2230 Intel®
CNVi (Integrated WiFi/BT)**
* Supports NVMe SSD as boot disks
** CNVi BT shares bandwidth with the top USB 2.0 port (USB_1)
on the rear I/O. When CNVi BT is used, USB_1 becomes
unavailable.
Graphics
•
Intel® UHD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
•
Intel® X
e
Graphics Architecture (Gen 12)
•
ree graphics output options: eDP 1.4, HDMI and
DisplayPort 1.4