Remove or minimize the presence of dust and particulates at the installation site by following the guidelines
mentioned in ANSI 71-04-2013 regulations.
In addition to the guidelines mentioned in ANSI 71-04-2013 regulations, follow all applicable guidelines as
per site conditions to remove or minimize other contaminants.
Note
Corrosion
Corrosion is a chemical reaction that occurs between electronic components and gases which results in metal
deterioration. Corrosion attacks edge connectors, pin connectors, IC plug-in sockets, wirewraps, and all other
metal components. Depending on the type and concentration level of the corrosive gases, performance
degradation of the components occurs either rapidly or over a period of time. It also leads to blocked currents,
brittle connection points, and overheated electrical systems. Corrosion by-products form insulating layers on
circuits and causes electronic failure, short circuits, pitting, and metal loss.
A type of corrosion known as creep corrosion, that primarily affects PCBA (Printed Circuit Board Assembly)
occurs when the PCBA is subjected to a harsh, and sulfur-rich (hydrogen sulfide) end-use environment over
a prolonged period of time. The corrosion begins on certain exposed metals, such as copper and silver, and
then creeps along the remaining metal surface either causing electrical short circuits or creating holes. Creep
corrosion also occurs on electronic components such as resistors and PCBs.
To prevent corrosion, remove or minimize the presence of dust and particulates at the installation site by
following the guidelines mentioned in ANSI 71-04-2013 regulations.
Cisco Catalyst 9500 Series Switches Hardware Installation Guide
28
Preparing for Installation
Corrosion
To Next Page
Loading...
Need help?
General
