SM C_BAT
VA35
VIN11, 35,36, 37,38,39,40,41
SYS3V35,36
12/17 PWR CHANGE
12 /17 PWR CHANGE
12/17 P WR CHANGE
COMP
1 2/17 PWR CHANGE
BAT_DET
AC_IN # 34
BAT_VO LT 34
AC_IN 36
SM D_BAT_R
LDR
VD D311,18,27,30,34,35,36,37,41
V_BAT
PR 240
* 5.1_06
PC 210
* 220p_50V_NPO _04
12/ 22
EMI ? ? ,? n oi se ? ?
SM D_BAT
SM C_BAT
BA T_DET
SM C_BAT_R
LX_C HG
VAC
PC 136
*1u_25V_08
PU 9
OZ8681
LX
14
LDR
16
BST
12
VAC
1
VDD P
15
IACM
3
VDDA
6
SDA
11
ICHP
5
IC HM
4
COMP
8
HDR
13
BASE
17
SC L
10
IAC
7
IACP
2
ACAV
9
PC 105
0.1u_50V_Y5V _06
PR164
*15mil_short_06
PC 13 8
1u_10V_06
PR 163
0_04
J_DC _JACK1
50932-00301-001
GN D 2
GN D 1
2
1
PD15 R B0540S2
AC
PR 79
60.4K_1%_04
PQ 17
MTP3403N3
G
DS
PD18
BA V99 R ECT IFIER
A
C
AC
PR 14 9
10_06
JBATTA1
tBTD -1010009
1
2
3
4
5
PR15 3 1M_04
PL5
TMPC0603H -6R8M-Z01
PQ20
M TN 7002ZHS3
G
DS
PD17
BA V99 R ECT IFIER
A
C
AC
PC 135
0.047u_10V_X7R _04
PR1
15 K _ 0 4
PR156
10K_04
PR152 10K_0 4
PR2
100K_04
PR4
0.02_1%_32
PC 12 6
0.1u_50V _Y 5V _06
PQ 39
M TN7002ZH S3
G
DS
PR 154
200K_1%_04
PR11 5
10 K _ 0 4
PR 3 10_06
PC12
4.7u_25V_X5R_08
PC11
4.7u_25V_X5R_08
PR161 0_04
PR78
300K_1%_04
PQ 37
M TN700 2 ZHS 3
G
DS
PC125
1u_25V_08
PC108 4.7u_25V_X5R _08
PR157 10_06
PD16
BA V99 R ECT IFIER
A
C
AC
PC 13 2
1000P_50V_X7R_04
PC13 3
0.047u_10V_X7R _04
PR150 4.7K_04
PC10 4.7u_25V_X5R_08
PC130 0.1u_50V_Y5V_06
PC 68
0.1u_16V_Y 5V _04
PR151 4.7K_04
AC A V
IACM
IACP
PC 127
*1u_25V_08
PQ1B
PD1503Y VS
4
3
5
6
PL2
H CB4532K-800T90
PC 137
0.47u_10V_Y 5V_04
PQ28
MEP4435Q8
4
6 2
5
7 3
1
8
PC129 * 4.7u_25V_X5R_08
PR16 0
100K_04
PQ1A
PD1503Y VS
7
8
1
2
PC9 4.7u_25V_X5R_08
PC128 *4.7u_25V _X5R _08
PR162
100_04
PQ 2
MEP4435Q8
4
62
5
73
1
8
PR166 10_06
PC 8
4.7u_25V_X5R _08
PR 123
0.02_1%_32
PR 85
100K_1%_04
PC 13
4.7u_25V_X5R _08
PC 123
1u_10V_06
V_BA T
VA
VIN
VA
SM D_BAT 3 4
BA T_ DE T34
TO T A L _ C U R 3 4
SM C_BAT 3 4
CH G_RST34
PR158 100K_04 PQ38
MTN7002ZH S3
G
DS
PR159
100_04
C369 47P _50V_NPO _04
P CB Lay out no tes
Reset circuit
V_BAT
V DD3
PR165 10_06
PD 14
R B0540S2
AC
12 /2 1
12 /2 1
1) Al l p ower traces s hould be routed on the outer la yers
GNDP, VAD, VSYS, LX, VCHG, V BATT
2) Use Kel vin connec t ions f or R3, R4
(sepe rate f orce and meas urement t races)
3) R23 and R 24 are d ummy r esi stors, f or l ayout pur poses onl y
(ser ves as single poi nt connec tion b etween GNDP & GNDA)
4) Foo tprint TO-236 i s equival ent to SOT-23
5) Foo tprint SIP/1P is a s ingl e hole axi al pad
6) Al l r esi si tors, capa citor s and semiconductor s are SMD
7) Pote nt iometer s, and t est poin ts are axi al devices
12/06 net? ?
VDD P
IC HMBST_
PR155 *470K_04
IC HP
PR23 5 0_04
PR23 4 0_04
IA C1
VA
VD D3
VDD 3
6. 8U H_7 .3 *6 .6* 2. 8M M
? ? JB AT TA 1