6-2 Maintenance 8525B/8528 Technical Service Manual
Issue 6 Publication No: 15-02036
• Unsoldering—When unsoldering use a solder-sucker or Solderwick to
remove solder. DO NOT USE SHARP METAL TOOLS SUCH AS
SCREWDRIVERS OR TWIST DRILLS AS THESE WILL DAMAGE
THE PRINTED CIRCUIT TRACK.
• Component substitution—Avoid unnecessary component substitution as
this may damage the component, the circuit track or adjacent
components.
• Component replacement—When a component is diagnosed as
defective, or the fault cannot be diagnosed in any other way than by
substitution, observe the following when installing the replacement:
- Axial leads—Components with axial leads, e.g. resistors and
tubular capacitors, can often be replaced without unsoldering the
joints on the boards. The defective component can be removed by
clipping its leads close to the component leaving the leads soldered
to the board. These leads should be straightened so that the leads of
the replacement can be wrapped around them and soldered. After
soldering the excess lead should be clipped off.
- Remove solder—When a component has been unsoldered from the
board ensure the holes are clear of solder before inserting the leads
of the replacement. ON NO ACCOUNT FORCE THE LEADS
THROUGH THE HOLES AS THIS WILL DAMAGE THE
CIRCUIT TRACK PARTICULARLY WHERE PLATED
THROUGH HOLES ARE USED.
- Observe orientation—When replacing diodes, transistors,
electrolytic capacitors or integrated circuits, before removing the
defective component, observe any marking indicating polarity or
orientation. It is essential that these types of components are
installed with the correct connections. If necessary consult the
manufacturer’s data for indications of the polarity of diodes or
capacitors and connectors of transistors.
- Heat sinking—Whenever possible use long-nosed pliers or some
other form of heat sinking on the leads of heat sensitive
components while soldering them to the board.
- Thermal conduction—When replacing transistors which are
mounted on heat sinks ensure good thermal conduction between the
heat sink and the replacement by cleaning the mounting surfaces
and recoating them with a thermal conduction compound such as
Jermyn Thermaflow A30.
• Track repair—Broken or burned sections of printed circuit track can be
repaired by bridging the damaged section with tinned copper wire. The
section where the repair is to be made must be cleaned observing the
precautions outlined above before soldering.