Table 24. Particulate contamination specifications (continued)
Particulate contamination Specifications
NOTE: Common sources of conductive dust include
manufacturing processes, and zinc whiskers from the
plating on the bottom of raised floor tiles
Corrosive dust
● Air must be free of corrosive dust.
● Residual dust present in the air must have a deliquescent
point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data
center environments.
Table 25. Gaseous contamination specifications
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Thermal air restrictions
ASHRAE A2 environment
● CPU TDP > 280 W are not supported.
● PCIe card TDP > 25 W is not supported.
● Nvidia A100 80 GB GPU (Max TDP with 500 W) is not supported within ASHRAE A2. Maximum Ambient temperature
supported is 28°C.
Technical specifications
17
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