Table 35. Intel AX211 specifications(continued)
Description Value
Bluetooth data rates Up to 3 Mbps
Bluetooth operating frequency bands 2.4 GHz
Bluetooth profiles supported Support for Microsoft Inbox Bluetooth profiles in Windows
Bluetooth data encryption 128-bit encryption
Bluetooth output power Power class 1
Operating temperature 0°C to +50°C (Full performance at shield temperatures up to
8
0°C)
Storage temperature -40°C to +70°C
Humidity Up to 90% RH non-condensing (at temperatures of 25°C to
35°C)
NOTE:
*Other names and brands may be claimed as the property of others.
WWAN module
Qualcomm Snapdragon SDX12 Global LTE-Advanced (DW5825e)
The following table lists specifications of the Qualcomm Snapdragon SDX12 Global LTE-Advanced (DW5825e) WWAN module.
Table 36. Qualcomm Snapdragon SDX12 Global LTE-Advanced (DW5825e) specifications
Description Value
Form factor M.2 3042 Key-B
Host interface USB 3.0/2.0
Network standard
● LTE FDD/TDD
● WCDMA/HSPA+
● GPS/GLONASS/Beidou/Galileo
Transfer rate
● Up to 600 Mbps DL (CAT6)
● Up to 150 Mbps UL
Operating frequency bands
● LTE (B1, B2, B3, B4, B5, B7, B8, B12, B13, B14, B17, B18,
B
19, B20, B25, B26, B28, B29, B30, B32, B38, B39, B40,
B41, B42, B43, B48, B66, B71)
● HSPA+ (1,2,4,5,6,8,19)
Power supply DC 3.135 V to 4.4 V, Typical 3.3 V
SIM card Supported through external SIM-card slot
eSIM with Dual SIM (DSSA) Supported
NOTE:
The availability of eSIM functionality embedded on
the module is dependent on the region and specific carrier
requirements.
Antenna diversity Supported
Radio On/Off Supported
Wake on wireless Supported
Normal operating temperature -10°C to +55°C
Engineering specifications 35
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