Ebyte E32 Series - 8 Production Guidance; Reflow Soldering Temperature; Reflow Soldering Curve

SX1278 Wireless Module E32 Series User Manual
Copyright ©2012–2017, Chengdu Ebyte Electronic Technology Co., Ltd. 23 / 24
8. Production guidance
8.1 Reflow soldering temperature
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
100℃
150℃
Preheat temperature max (Tsmax)
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
3℃/second max
3℃/second max
Liquidous Temperature (TL)
183℃
217℃
Time（tL）Maintained Above（TL）
60-90 sec
30-90 sec
Peak temperature（Tp）
220-235℃
230-250℃
Average ramp-down rate（Tp to Tsmax）
6℃/second max
6℃/second max
Time 25℃ to peak temperature
6 minutes max
8 minutes max
8.2 Reflow soldering curve