Foxconn H55MXV LE User Manual

1
2
1-1 Product Specications
CPU Support LGA 1156 socket Intel
®
CPU:
Intel
®
Core
TM
i7, Core
TM
i5 and Core
TM
i3 processors
DMI Bus Full duplex up to 10Gb/s each direction
Chipset Intel
®
H55
Memory 2 x 240-pin DDR3 DIMM sockets
Support up to 8GB of system memory
Dual channel DDR3 1333/1066MHz architecture
Audio Realtek 6-channel audio chip
High Denition Audio
2/4/5.1-channel
Support for S/PDIF out
Support Jack-Sensing function
LAN Realtek 10/100/1000Mb/s LAN chip
Expansion Slots 1 x PCI Express x16 slots
1 x PCI Express x1 slots
2 x PCI slot
Onboard Serial ATA 6 x SATA connectors
300MB/s data transfer rate
Support hot plug and NCQ (Native Command Queuing)
USB Support hot plug
Supports up to 12 x USB 2.0 ports (6 rear panel ports, 3 onboard USB head-
ers supporting 6 extra ports)
Support USB 2.0 protocol up to 480Mb/s
Internal Connectors 1 x 24-pin ATX main power connector
1 x 4-pin ATX 12V power connector
1 x CPU fan header (4-pin)
1 x System fan headers (4-pin)
1 x Front Audio connector
1 x SPDIF-OUT connector
1 x Speaker connector
3 x USB 2.0 connectors (supporting 6 x USB devices)
1 x Front Panel connector
6 x SATA connectors
1 x TPM connector
1 x COM connector
1 x INTR connector
1 x CIR connector
Back Panel 1 x PS/2 port
Connectors 1 x Parallel port
6 x USB 2.0 ports
1 x DVI-D port
1 x VGA port
1 x RJ-45 LAN port

Foxconn H55MXV LE Specifications

General

Form Factor	Micro ATX
CPU Socket	LGA 1156
Memory Type	DDR3
Maximum Memory	8 GB
PCIe 2.0 x1 Slots	1
USB Ports (Rear)	4
Chipset	Intel H55
Memory Slots	2
Expansion Slots	1 x PCIe x1
Audio	Realtek ALC662
LAN	Realtek RTL8111DL Gigabit Ethernet
Video Outputs	VGA
USB Ports	8 (4 rear, 4 via headers)
VGA Port	Yes