Foxconn H61AP Series - Product Specifications Overview

PRODUCT INTRODUCTION
2
1-1 Product Specications
CPU Support Intel
®
Ivy Bridge/Sandy Bridge LGA1155 Processors
Max processor power up to 95W
For the latest CPU information, please visit:
http://www.foxconnsupport.com/cpusupportlist.aspx
Chipset Intel
®
H61
Memory 2 x 240-pin DDR3 DIMMs
Support up to 16GB of system memory
Dual channel DDR3 1600(Ivy Bridge)/1333/1066 MHz architecture
Expansion Slots 1 x PCI Express X16 slot
-Support PCI Express Gen2 5GT/s data rate (Sandy Bridge)
-Support PCI Express Gen3 8GT/s data rate (Ivy Bridge)
6 x PCI slots
Storage Intel
®
H61 chipset
- 4 x SATA 2.0 connectors (3Gb/s data transfer rate)
Asmedia ASM1061:
- 2 x SATA 3.0 connectors (6Gb/s data transfer rate) (only for H61AP-S)
LAN
Realtek 8111F Gigabit LAN chip
Support 10/100/1000Mbps
Audio Realtek ALC662 Audio chip:
-High Denition Audio
-2/4/5.1-channel
-Support for SPDIF Out
-Support Jack-Sensing function
USB Support up to 10 x USB 2.0 ports (4 rear panel ports, 3 onboard USB
headers supporting 6 extra ports) (H61AP)
Support up to 8 x USB 2.0 ports (2 rear panel ports, 3 onboard USB
headers supporting 6 extra ports)(H61AP-S)
Support up to 2 x USB 3.0 ports(only for H61AP-S)
Support USB 2.0 protocol up to 480Mb/s
Support USB 3.0 protocol up to 5Gb/s
Internal
Connectors
1 x 24-pin ATX power connector
1 x 4-pin ATX 12V power connector
4 x SATA 2.0 connectors
2 x SATA 3.0 connectors(H61AP-S)
3 x USB 2.0 header (supporting 6 x USB devices)
1 x CPU Fan header (4-pin)
1 x System Fan header (4-pin)
1 x Front panel header
1 x Front Audio header
1 x SPDIF_OUT header
1 x Speaker header
1 x Intrusion Alarm header
1 x COM2 header
1 x TPM header