Shenzhen Hi-Link Electronic Co., Ltd. Manual
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Content
1. Product introduction ..................................................................................................3
2. Product features and benefits................................................................................... 4
2.1
Features.................................................................................................................. 4
2.2
Solution advantage .................................................................................................4
3. Application scenarios.................................................................................................5
4. Hardware description................................................................................................ 6
4.1
Dimensions.............................................................................................................6
4.2
Pin definition..........................................................................................................7
5. Use and configuration................................................................................................8
5.1
Typical application circuit ..................................................................................... 8
5.2
The role of configuration parameters .................................................................... 8
5.3
Visual configuration tool description .................................................................... 9
5.4
Mounting method and sensing range ...................................................................10
5.5
Installation conditions ..........................................................................................12
6. Bluetooth instructions ..............................................................................................13
6.1
Install software ..................................................................................................... 13
6.2
Instructions...........................................................................................................13
6.3 Bluetooth password..............................................................................................13
6.4 OTA upgrade
........................................................................................................13
6.5
Bluetooth communication protocol ..................................................................... 13
6.6
Turn on bluetooth again ....................................................................................... 16
7. Performance and electrical parameters ................................................................ 17
8. Radome design guidelines ....................................................................................... 18
8.1
Effects of radomes on mm wave sensor performance.........................................18
8.2
Radome design principles....................................................................................18
8.3
Common materials ............................................................................................... 18
9. Revision records....................................................................................................... 19
10. Technical support and contact ..............................................................................19
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