Hi-Link HLK-LD2410C - Table of Contents

Shenzhen Hi-Link Electronic Co., Ltd. Manual
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HLK-LD2410C
Content
1. Product introduction ..................................................................................................3
2. Product features and benefits................................................................................... 4
2.1 Features.................................................................................................................. 4
2.2 Solution advantage .................................................................................................4
3. Application scenarios.................................................................................................5
4. Hardware description................................................................................................ 6
4.1 Dimensions.............................................................................................................6
4.2 Pin definition..........................................................................................................7
5. Use and configuration................................................................................................8
5.1 Typical application circuit ..................................................................................... 8
5.2 The role of configuration parameters .................................................................... 8
5.3 Visual configuration tool description .................................................................... 9
5.4 Mounting method and sensing range ...................................................................10
5.5 Installation conditions ..........................................................................................12
6. Bluetooth instructions ..............................................................................................13
6.1 Install software ..................................................................................................... 13
6.2 Instructions...........................................................................................................13
6.3 Bluetooth password..............................................................................................13
6.4 OTA upgrade ........................................................................................................13
6.5 Bluetooth communication protocol ..................................................................... 13
6.6 Turn on bluetooth again ....................................................................................... 16
7. Performance and electrical parameters ................................................................ 17
8. Radome design guidelines ....................................................................................... 18
8.1 Effects of radomes on mm wave sensor performance.........................................18
8.2 Radome design principles....................................................................................18
8.3 Common materials ............................................................................................... 18
9. Revision records....................................................................................................... 19
10. Technical support and contact ..............................................................................19