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Identifies PCBs/PCAs over 10 sq cm requiring selective treatment.
Covers Li-Ion and non-Li-Ion batteries for selective treatment.
Includes mercury in lamps, backlights, and switches.
Refers to CRT components requiring selective treatment.
Components and waste materials containing asbestos.
Materials containing refractory ceramic fibers requiring selective treatment.
Components containing radioactive substances for selective treatment.
Components containing CFCs, HCFCs, HFCs, or HC for selective treatment.
Procedure to heat and remove large electrolytic capacitors.
Identifies PCBs/PCAs over 10 sq cm requiring selective treatment.
Covers Li-Ion and non-Li-Ion batteries for selective treatment.
Includes mercury in lamps, backlights, and switches.
Refers to CRT components requiring selective treatment.
Components and waste materials containing asbestos.
Materials containing refractory ceramic fibers requiring selective treatment.
Components containing radioactive substances for selective treatment.
Components containing CFCs, HCFCs, HFCs, or HC for selective treatment.
Procedure to heat and remove large electrolytic capacitors.
| Form Factor | Tower |
|---|---|
| Memory | Up to 128 GB DDR4-3200 SDRAM |
| Storage | Up to 2TB SSD |
| Graphics | Intel UHD Graphics 770 |
| Operating System | Windows 11 Pro |
| Network | Integrated Intel I219-LM GbE |
| Expansion Slots | 1 PCIe 3.0 x1 |
| Ports (Rear) | DisplayPort |
| Power Supply | 400 W 92% efficient, active PFC |
| Dimensions | 6.1 in |
| Ports (Front) | Headphone/microphone combo jack, USB ports |












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