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HP Elite x2 1011 G1 Maintenance And Service Guide

HP Elite x2 1011 G1
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Equipment guidelines
Grounding equipment must include either a wrist strap or a foot strap at a grounded workstation.
When seated, wear a wrist strap connected to a grounded system. Wrist straps are flexible straps with a
minimum of one megohm ±10% resistance in the ground cords. To provide proper ground, wear a strap
snugly against the skin at all times. On grounded mats with banana-plug connectors, use alligator clips
to connect a wrist strap.
When standing, use foot straps and a grounded floor mat. Foot straps (heel, toe, or boot straps) can be
used at standing workstations and are compatible with most types of shoes or boots. On conductive
floors or dissipative floor mats, use foot straps on both feet with a minimum of one megohm resistance
between the operator and ground. To be effective, the conductive must be worn in contact with the
skin.
The following grounding equipment is recommended to prevent electrostatic damage:
Antistatic tape
Antistatic smocks, aprons, and sleeve protectors
Conductive bins and other assembly or soldering aids
Nonconductive foam
Conductive slateop workstations with ground cords of one megohm resistance
Static-dissipative tables or floor mats with hard ties to the ground
Field service kits
Static awareness labels
Material-handling packages
Nonconductive plastic bags, tubes, or boxes
Metal tote boxes
Electrostatic voltage levels and protective materials
The following table lists the shielding protection provided by antistatic bags and floor mats.
Material Use Voltage protection level
Antistatic plastics Bags 1,500 V
Carbon-loaded plastic Floor mats 7,500 V
Metallized laminate Floor mats 5,000 V
Grounding guidelines 33

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HP Elite x2 1011 G1 Specifications

General IconGeneral
SteppingF0
Tjunction95 °C
Processor codeSR23L
Processor cache4 MB
Processor cores2
System bus rate- GT/s
Processor familyIntel® Core™ M
Processor seriesIntel Core M-5Y Mobile series
Processor threads4
Processor codenameBroadwell
Processor frequency1.1 GHz
Processor cache typeL3
Processor manufacturerIntel
Processor package size30 x 16.5 mm
Conflict-Free processorYes
Processor front side bus- MHz
Processor boost frequency2.6 GHz
Processor operating modes32-bit, 64-bit
Graphics & IMC lithography14 nm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Thermal Design Power (TDP)4.5 W
Scenario Design Power (SDP)3.5 W
Configurable TDP-down frequency0.6 GHz
Internal memory8 GB
Memory clock speed1600 MHz
Internal memory typeDDR3L-SDRAM
Storage mediaSSD
Compatible memory cardsMicroSD (TransFlash)
Internal storage capacity256 GB
Display diagonal11.6 \
Touch technologyMulti-touch
Graphics cardHD Graphics 5300
Rear camera typeSingle camera
Rear camera resolution (numeric)5 MP
Front camera resolution (numeric)2 MP
Processor ARK ID84669
Processor socketBGA 1234
Wi-Fi standards802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version4.0
Top Wi-Fi standardWi-Fi 5 (802.11ac)
Near Field Communication (NFC)-
Microphone inNo
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Country of originChina
Device typeTablet PC
Form factorSlate
Product colorBlack, Silver
Intel Identity Protection Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Battery capacity- mAh
Battery life (max)9 h
PlatformWindows
Operating system installedWindows 8.1 Pro
Weight and Dimensions IconWeight and Dimensions
Depth192.7 mm
Width298 mm
Height10.7 mm
Weight780 g

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