HP ELITE x2 1012 G1 Quickspecs

QuickSpecs
HP Elite x2 1012 G1
Technical Specifications
Not all configuration components are available in all regions/countries.
c04895999 — DA – 15477 — Worldwide — Version 16 – March 22, 2017
Page 29
 Lead and Lead compounds
 Mercuric Oxide Batteries
 Nickel – finishes must not be used on the external surface designed to
be frequently handled or carried by the user.
 Ozone Depleting Substances
 Polybrominated Biphenyls (PBBs)
 Polybrominated Biphenyl Ethers (PBBEs)
 Polybrominated Biphenyl Oxides (PBBOs)
 Polychlorinated Biphenyl (PCB)
 Polychlorinated Terphenyls (PCT)
 Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail
packaging has been voluntarily removed from most applications.
 Radioactive Substances
 Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage
HP follows these guidelines to decrease the environmental impact of product
packaging:
 Eliminate the use of heavy metals such as lead, chromium, mercury and
cadmium in packaging materials.
 Eliminate the use of ozone-depleting substances (ODS) in packaging
materials.
 Design packaging materials for ease of disassembly.
 Maximize the use of post-consumer recycled content materials in
packaging materials.
 Use readily recyclable packaging materials such as paper and corrugated
materials.
 Reduce size and weight of packages to improve transportation fuel
efficiency.
 Plastic packaging materials are marked according to ISO 11469 and DIN
6120 standards.
End-of-life
Management and
Recycling
Hewlett-Packard offers end-of-life HP product return and recycling programs in
many geographic areas. To recycle your product, please go to:
http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office.
Products returned to HP will be recycled, recovered or disposed of in a
responsible manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide
treatment information for each product type for use by treatment facilities. This
information (product disassembly instructions) is posted on the Hewlett Packard
web site at: http://www.hp.com/go/recyclers. These instructions may be used
by recyclers and other WEEE treatment facilities as well as HP OEM customers
who integrate and re-sell HP equipment.
Hewlett-Packard
Corporate
Environmental
Information
For more information about HP’s commitment to the environment:
Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-
information/environment/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU
_Product_Design_ISO_14K_Certificate.pdf
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

HP ELITE x2 1012 G1 Specifications

General

Bus type	OPI
Stepping	D1
Tjunction	100 °C
Processor code	SR2EN
Processor cache	4 MB
Processor cores	2
Processor family	Intel® Core™ m3
Processor series	Intel Core m3-6Y series
Processor socket	BGA 1515
Processor threads	4
Processor codename	Skylake
Processor frequency	0.9 GHz
Processor cache type	Smart Cache
Processor manufacturer	Intel
Processor package size	20 X 16.5 mm
Conflict-Free processor	Yes
PCI Express slots version	3.0
Processor boost frequency	2.2 GHz
Processor operating modes	32-bit, 64-bit
ECC supported by processor	No
Graphics & IMC lithography	14 nm
PCI Express configurations	1x2+2x1, 2x2, 1x4, 4x1
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Thermal Design Power (TDP)	4.5 W
Maximum number of PCI Express lanes	10
Device type	Tablet PC
Form factor	Slate
Product color	Silver
Internal memory	4 GB
Memory clock speed	1866 MHz
Internal memory type	LPDDR3-SDRAM
Storage media	SSD
Compatible memory cards	MicroSD (TransFlash)
Internal storage capacity	180 GB
Display diagonal	12 \
Touch technology	Multi-touch
Display resolution	1920 x 1280 pixels
Graphics card	HD Graphics 515
On-board graphics card ID	0x191E
On-board graphics card model	Intel® HD Graphics 515
Maximum on-board graphics card memory	1.74 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card dynamic frequency (max)	850 MHz
Rear camera type	Single camera
Rear camera resolution (numeric)	5 MP
Front camera resolution (numeric)	2 MP
Country of origin	China
Wi-Fi standards	802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version	4.2
Top Wi-Fi standard	Wi-Fi 5 (802.11ac)
Battery capacity	2800 mAh
Battery life (max)	10 h
AC adapter power	45 W
USB 2.0 ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	1
Sustainability certificates	ENERGY STAR
Platform	Windows
Operating system architecture	64-bit
Processor ARK ID	88198
Intel Secure Key Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	213.5 mm
Width	300 mm
Height	8.05 mm
Weight	820 g