HP EliteOne 800 G3 Disassembly Instructions

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Star(Torx) screwdriver OD 3.3mm..
Cross(Philips) screwdriver OD 3.0mm
Cross(Philips) screwdriver OD 2.0mm
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Refer to 1~4 to disassemble rear cover and IO pocket
2. Refer to 5~6 to disassemble VESA bracket and Fan
3. Refer to 7~8 to disassemble Thermal module
4. Refer to 9~12 to disassemble HDD and ODD
5. Refer to 13~14 to disassemble Webcam module
6. Refer to 15~16 to disassemble WLAN card and SSD card
7. Refer to 17~18 to disassemble Power supply and Audio jack cable
8. Refer to 19 to disassemble IO shielding
9. Refer to 20~22 to disassemble Power button board and Finger print
10. Refer to 23~25 to disassemble MB and CPU and Memory
11. Refer to 26~27 to disassemble Thermal pad and Base pan
12. Refer to 28 to disassemble Speaker and Antenna
13. Refer to 29 to disassemble LVDS and Backlight cable and Touch cable
14. Refer to 30 to disassemble LCD
15.
16.
17.
18.
19.
20.
21.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
AIO system disassembly
1. Place the system

HP EliteOne 800 G3 Specifications

General

Tcase	71 °C
Bus type	DMI3
Stepping	R0
Processor code	SR2BX
Processor cache	6 MB
Processor cores	4
Processor model	i5-6500
System bus rate	8 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-6500 Desktop series
Processor socket	LGA 1151 (Socket H4)
Processor codename	Skylake
Processor frequency	3.2 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
Conflict-Free processor	Yes
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	3.6 GHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	65 W
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3L-SDRAM, DDR4-SDRAM
Memory voltage supported by processor	1.35 V
Memory clock speeds supported by processor	2133, 1333, 1600, 1866 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Maximum internal memory supported by processor	64 GB
Discrete graphics card	No
On-board graphics card ID	1912
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 530
Maximum on-board graphics card memory	1.74 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1050 MHz
Number of displays supported (on-board graphics)	3
Color gamut	72 %
RGB color space	NTSC
Display diagonal	23.8 \
Native aspect ratio	16:9
Product type	All-in-One PC
Motherboard chipset	Intel® Q270
Memory slots	2
Internal memory	8 GB
Memory slots type	SO-DIMM
Memory clock speed	2400 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	32 GB
Memory layout (slots x size)	1 x 8 GB
SSD capacity	256 GB
SSD interface	PCI Express
Storage media	SSD
Optical drive type	DVD-RW
Card reader integrated	-
Number of storage drives installed	1
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	6
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	0
Product color	Black, Silver
Country of origin	China
Antenna type	2x2
Wi-Fi standards	Wi-Fi 5 (802.11ac)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
AC adapter power	180 W
Recovery operating system	Windows 10 Pro
Operating system installed	Windows 7 Professional
Scalability	1S
Processor ARK ID	88184
Processor package size	37.5 x 37.5 mm
Supported instruction sets	SSE4.2, AVX 2.0, SSE4.1
Thermal solution specification	PCG 2015C
Intel Identity Protection Technology version	1.00

Weight and Dimensions

Depth (with stand)	53.8 mm
Width (with stand)	539.6 mm
Height (with stand)	314.8 mm
Weight (with stand)	6030 g