7. Remove the heat sink (2).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and
the system board components, it may be necessary to move the heat sink from side to side to
detach it.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the
system board components each time the heat sink is removed. Replacement thermal material is
included with the heat sink, processor, and system board spare part kits.
1. Clean and then replace the thermal paste used on the processor (1) and the heat sink section
(2) that services it.
2. If the heat sink has a graphics subsystem chip (3) and the heat sink section (4) that services it,
clean and then replace that thermal paste.
Component replacement procedures 73
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