EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
Description #1 Phillips screwdriver (for 12 PCS on bottom case )
Description #2 Phillips screwdriver (for 9 PCS on motherboard)
Description #3 Phillips screwdriver (for 2 PCS on HDD Bracket & 4 PCS on Battery)
Description #4 Phillips screwdriver (for 10 PCS on base side hinge bracket)
Description #5 Use jig disassembly Lcd Bezel with Lcd cover
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove rear side rubber foot refer figure 1
2. Release 7pcs Phillips screw from bottom case refer figure 2
3. Two hand together dissemble bottom case from arrow side refer figure 3
4. Release 7pcs Phillips screw from Battery refer figure 4
5. Dissemble:DC-in cable、WLAN cable 、 CCD cable 、 EDP cable 、SPK cable 、SD FFC 、HDD FFC 、KB BL
FPC 、 KB FPC 、TP FFC refer figure 5
6. Release 14pcs Phillips screw from PCB, Next Teardown Mainboard and SD board refer figure 6
7. Release 3pcs Phillips screw from left side hinge bracket refer figure 7
8. Release 3pcs Phillips screw from right side hinge bracket refer figure 8
9. Dissemble LCD module initial step pick insert gap between LCD Cover and LCD Bezel refer figure 9
10. Release 6pcs Phillips screw from right & left hinge Bracket refer figure 10
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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