2. Remove the heat sink (2).
3. Thoroughly clean the thermal material from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal material is included with
the heat sink and system board spare part kits. The following illustration shows the replacement
thermal material locations.
Thermal paste is used on the processor (1) and on the heat sink area (2) that services the
processor.
4. In the order indicated on the heat sink, remove the four Phillips M2.0 × 3.3 screws (1) that secure the
heat sink to the system board.
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Chapter 5 Removal and replacement procedures for authorized service provider parts