HP Pavilion dm4 User Manual

Spare part
number
Description
608211-001 Display Cable Kit
608212-001 Display Screw Kit
608214-001 Display bracket (with hinges)
608215-001 Hard drive, 160-GB, solid state
608221-001 DVD±RW SuperMulti DL Drive
608222-001 Keyboard for use in the United States
608222-031 Keyboard for use in the United Kingdom
608222-041 Keyboard for use in Germany
608222-051 Keyboard for use in France
608222-071 Keyboard for use in Spain
608222-121 Keyboard for use in English and French Canada
608222-141 Keyboard for use in Turkey
608222-161 Keyboard for use in Latin America
608222-171 Keyboard for use in Saudi Arabia
608222-201 Keyboard for use in Brazil
608222–251 Keyboard for use in Russia
608222-281 Keyboard for use in Thailand
608222-291 Keyboard for use in Japan
608222-AB1 Keyboard for use in Taiwan
608222-AD1 Keyboard for use in South Korea
608222-B31 Keyboard for use in Europe, the Middle East, and Africa
608222-BG1 Keyboard for use in Switzerland
608222-DH1 Keyboard for use in the Netherlands
608223-001 Base enclosure
608224-001 Top cover (includes Touchpad and bracket, button board, and cable)
608225-001 Fingerprint reader board
608226-001 Power button board (includes cable)
608227-001 Misc Cable Kit (includes Bluetooth module cable and hard drive cable)
608228-001 Rubber feet
608229-001 Fan/heat sink for use in models with UMA graphics (includes replacement thermal material)
608231-001 Fan/heat sink assembly for use in models with discrete graphics (includes replacement thermal material)
608232-001 Speaker assembly (includes cable)
608233-001 Plastics Kit
608234-001 Screw Kit
Sequential part number listing 33

HP Pavilion dm4 Specifications

General

Bus type	DMI
Stepping	C2
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-400 Series
Processor socket	BGA 1288
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	2.26 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	2.53 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	17
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Motherboard chipset	Intel® HM55 Express
Memory slots	2x SO-DIMM
Internal memory	3 GB
Memory clock speed	1333 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	1 x 1 + 1 x 2 GB
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	Yes
Total storage capacity	500 GB
Compatible memory cards	Memory Stick (MS), MMC, MS PRO, SD, xD
Number of HDDs installed	1
Display diagonal	14 \
Display brightness	200 cd/m²
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
Contrast ratio (typical)	500:1
Display response rise/fall	8 ms
Type	PC
LightScribe	-
Disc types supported	CD-R, CD-ROM, CD-RW, DVD+R, DVD+RW, DVD-R, DVD-RAM, DVD-ROM, DVD-RW
Ethernet interface type	Gigabit Ethernet
On-board graphics card model	Intel® HD Graphics
On-board graphics card base frequency	500 MHz
On-board graphics card dynamic frequency (max)	766 MHz
Speakers manufacturer	Altec Lansing
Video capturing speed	24 fps
Front camera resolution	640 x 480 pixels
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n)
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit Ethernet, WLAN
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
Headphone connectivity	3.5 mm
USB 2.0 ports quantity	3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	0
Pointing device	Touchpad
Operating system installed	Windows 7 Home Premium
Form factor	Clamshell
Product type	Laptop
Country of origin	China
Battery life (max)	- h
Number of battery cells	6
AC adapter power	65 W
Cable lock slot type	Kensington
Processor code	SLBPM
Processor ARK ID	43537
Processor package size	rPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1, SSE4.2
Intel® Turbo Boost Technology	1.0
Operating altitude	-15 - 3048 m
Non-operating altitude	-15 - 12192 m
Storage temperature (T-T)	-20 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %

Weight and Dimensions

Depth	228 mm
Width	340.8 mm
Weight	1990 g
Height (rear)	32.2 mm
Height (front)	25 mm
Depth (imperial)	8.98 \
Width (imperial)	13.7 \
Height (rear) (imperial)	1.26 \
Height (front) (imperial)	0.98 \