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HP Pavilion dm4 User Manual

HP Pavilion dm4
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Equipment guidelines
Grounding equipment must include either a wrist strap or a foot strap at a grounded workstation.
When seated, wear a wrist strap connected to a grounded system. Wrist straps are flexible
straps with a minimum of one megohm ±10% resistance in the ground cords. To provide proper
ground, wear a strap snugly against the skin at all times. On grounded mats with banana-plug
connectors, use alligator clips to connect a wrist strap.
When standing, use foot straps and a grounded floor mat. Foot straps (heel, toe, or boot straps)
can be used at standing workstations and are compatible with most types of shoes or boots. On
conductive floors or dissipative floor mats, use foot straps on both feet with a minimum of one
megohm resistance between the operator and ground. To be effective, the conductive strips
must be worn in contact with the skin.
The following grounding equipment is recommended to prevent electrostatic damage:
Antistatic tape
Antistatic smocks, aprons, and sleeve protectors
Conductive bins and other assembly or soldering aids
Nonconductive foam
Conductive tabletop workstations with ground cords of one megohm resistance
Static-dissipative tables or floor mats with hard ties to the ground
Field service kits
Static awareness labels
Material-handling packages
Nonconductive plastic bags, tubes, or boxes
Metal tote boxes
Electrostatic voltage levels and protective materials
The following table lists the shielding protection provided by antistatic bags and floor mats.
Material Use Voltage protection level
Antistatic plastic Bags 1,500 V
Carbon-loaded plastic Floor mats 7,500 V
Metallized laminate Floor mats 5,000 V
Preliminary replacement requirements 39

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HP Pavilion dm4 Specifications

General IconGeneral
Bus typeDMI
SteppingC2
Tjunction105 °C
Processor cache3 MB
Processor cores2
System bus rate2.5 GT/s
Processor familyIntel® Core™ i5
Processor seriesIntel Core i5-400 Series
Processor socketBGA 1288
Processor threads4
Processor codenameArrandale
Processing Die size81 mm²
Processor frequency2.26 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor boost frequency2.53 GHz
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x16
Thermal Design Power (TDP)35 W
CPU multiplier (bus/core ratio)17
Maximum number of PCI Express lanes16
Number of Processing Die Transistors382 M
Motherboard chipsetIntel® HM55 Express
Memory slots2x SO-DIMM
Internal memory3 GB
Memory clock speed1333 MHz
Internal memory typeDDR3-SDRAM
Maximum internal memory8 GB
Memory layout (slots x size)1 x 1 + 1 x 2 GB
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi
Card reader integratedYes
Total storage capacity500 GB
Compatible memory cardsMemory Stick (MS), MMC, MS PRO, SD, xD
Number of HDDs installed1
Display diagonal14 \
Display brightness200 cd/m²
Display resolution1366 x 768 pixels
Native aspect ratio16:9
Contrast ratio (typical)500:1
Display response rise/fall8 ms
TypePC
LightScribe-
Disc types supportedCD-R, CD-ROM, CD-RW, DVD+R, DVD+RW, DVD-R, DVD-RAM, DVD-ROM, DVD-RW
Ethernet interface typeGigabit Ethernet
On-board graphics card modelIntel® HD Graphics
On-board graphics card base frequency500 MHz
On-board graphics card dynamic frequency (max)766 MHz
Speakers manufacturerAltec Lansing
Video capturing speed24 fps
Front camera resolution640 x 480 pixels
Wi-Fi standards802.11b, 802.11g, Wi-Fi 4 (802.11n)
Cabling technology10/100/1000Base-T(X)
Networking featuresGigabit Ethernet, WLAN
Ethernet LAN data rates10, 100, 1000 Mbit/s
Charging port typeDC-in jack
Headphone connectivity3.5 mm
USB 2.0 ports quantity3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity0
Pointing deviceTouchpad
Operating system installedWindows 7 Home Premium
Form factorClamshell
Product typeLaptop
Country of originChina
Battery life (max)- h
Number of battery cells6
AC adapter power65 W
Cable lock slot typeKensington
Processor codeSLBPM
Processor ARK ID43537
Processor package sizerPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography45 nm
Supported instruction setsSSE4.1, SSE4.2
Intel® Turbo Boost Technology1.0
Operating altitude-15 - 3048 m
Non-operating altitude-15 - 12192 m
Storage temperature (T-T)-20 - 60 °C
Operating temperature (T-T)5 - 35 °C
Storage relative humidity (H-H)5 - 95 %
Operating relative humidity (H-H)10 - 90 %
Weight and Dimensions IconWeight and Dimensions
Depth228 mm
Width340.8 mm
Weight1990 g
Height (rear)32.2 mm
Height (front)25 mm
Depth (imperial)8.98 \
Width (imperial)13.7 \
Height (rear) (imperial)1.26 \
Height (front) (imperial)0.98 \

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