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HP ZBook 17 G4 Mobile Workstation - Page 70

HP ZBook 17 G4 Mobile Workstation
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2. The following illustration shows the replacement thermal material locations. The thermal material must
be thoroughly cleaned from the surfaces of the heat sink and the system board components each time
the heat sink is removed. Replacement thermal material is included with the heat sink and system board
spare part kits.
Thermal paste is used on the system board components (2), (4), (6) and on the heat sink areas (1), (3),
(5) that service them.
Heat sink for use with models with UMA graphics memory
1. Loosen the screws in the numbered order shown (1, 2, 3, 4), and then remove the heat sink (5) from the
system board.
58 Chapter 6 Removal and replacement procedures for authorized service provider parts

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