MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Item Description Notes
of items
included
in product
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. PCA-Remove all of PCAs with screwdriver
2. Megacell Module– Remove the top cover and locate the megacell on the system. Remove the megacell and
dispose of properly.
3. Capacitors>2.5 cm-Removing the Node module from chassis, removing the node cover by pressing down cover latch,
locate the capacitors and use a medium flat head screwdriver to remove them and dispose of properly.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1-15 - PCA Pictures
Attachment 16 – Megacell Module Location
Attachment 17-20 – Super Cap Location in PSU
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