HPE Apollo 2000 Gen10 Plus System

MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Item Description Notes
Quantity
of items
included
in product
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
T10/T15
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. PCA-Remove all of PCAs with screwdriver
2. Megacell Module– Remove the top cover and locate the megacell on the system. Remove the megacell and
dispose of properly.
3. Capacitors>2.5 cm-Removing the Node module from chassis, removing the node cover by pressing down cover latch,
locate the capacitors and use a medium flat head screwdriver to remove them and dispose of properly.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1-15 - PCA Pictures
Attachment 16 – Megacell Module Location
Attachment 17-20 – Super Cap Location in PSU