Huawei EM770 - Reliability; Temperature

HUAWEI EM770 HSPA PC Embedded Module V100R001
Product Specification
Issue 1
(2008-09-15)
Huawei Confidential: This documents is Huawei Proprietary and Confidential(NDA
Required).It may not be duplicated, neither distributed externally without
prior and written permission of Huawei.
Page
18 of 68
2.2 Reliability
Table 2-1 Requirements on the environment reliability
Test Case Standard
High temperature IEC60068-2-2
High temperature IEC60068-2-1
Random vibration
MIL-STD-810F
-METHOD 514.5
Shock vibration ANSI/TIA-603-C-2004 -3.3.5
Operational
Sine sweep vibration ANSI/TIA-603-C-2004 -3.3.4
High temperature IEC60068-2-2
Low temperature IEC60068-2-1
Damp heat, cyclic IEC60068-2-30
Thermal shock IEC60068-2-14
Salt-fog IEC60068-2-11
Drop IEC 60068-2-32
Environment
reliability
Non-
operational
Durability EIA-364-9
2.3 Temperature
Description Minimum Maximum Unit
Operating temperature –10 +55 ℃
Storage temperature –40 +85 ℃
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