Huawei EM770 - 6 Technical Reference; Layer 1 Specifications (Physical); Layer 2 Specifications (MAC;RLC); Layer 3 Specifications (RRC)

HUAWEI EM770 HSPA PC Embedded Module V100R001
Product Specification
Issue 1
(2008-09-15)
Huawei Confidential: This documents is Huawei Proprietary and Confidential(NDA
Required).It may not be duplicated, neither distributed externally without
prior and written permission of Huawei.
Page
61 of 68
6 Technical Reference
6.1 Layer 1 Specifications (Physical)
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Examples of Channel Coding and Multiplexing TR 25.944
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Physical Layer–General Description TS 25.201
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Physical Channels and Mapping of Transport Channels onto Physical Channels
(FDD) TS 25.211
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Multiplexing and Channel Coding (FDD) TS 25.212
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Spreading and Modulation (FDD) TS 25.213
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Physical Layer–Procedures (FDD) TS 25.214
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Physical Layer–Measurements (FDD) TS 25.215
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3GPP HSPA overall description 25.308
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3GPP UE radio access capabilities 25.306
6.2 Layer 2 Specifications (MAC/RLC)
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MAC Protocol Specification TS 25.321
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RLC Protocol Specification TS 25.322
6.3 Layer 3 Specifications (RRC)
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UE Interlayer Procedures in Connected Mode TS 25.303
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UE Procedures in Idle Mode TS 25.304
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RRC Protocol Specification TS 25.331
6.4 Layer 3 NAS/Core Network (MM/CM)
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Architectural Requirements for Release 1999 TS 23.121
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NAS Functions Related to Mobile Station (MS) in Idle Mode TS 23.122
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Mobile Radio Interface Signaling Layer 3–General Aspects TS 24.007
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