Huawei NE40E-M2 Series - Page 59

7 Boards
Issue ()
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
57
Attribute
Description

8.10 1.25Gbps eSFP BIDI Optical Module

8.7 1.25Gbps CSFP BIDI Optical Module

8.8 125M-1.25Gbps CSFP BIDI Optical Module

8.12 125M~2.67Gbps eSFP DWDM Optical Module
Working mode
Full-duplex
Compliant standard
IEEE 802.3
Frame format
Ethernet_II, Ethernet_SAP, and Ethernet_SNAP
Table 7-11 Board specifications
Item
Specification
Dimensions (H x W x D)
19.8mm x 193.8mm x 209.3 mm (0.78 in. x 7.63 in. x 8.24
in.)
Typical power
consumption
51.5 W
Typical heat dissipation
167.1 BTU/hour
Weight
0.8 kg (1.76 lb)
Ambient temperature
Long terms: -5 °C to 55 °C (23°F to 131°F)
7.1.3 1-Port 100GBase-CFP2 Physical Interface Card(PIC)
Overview
Table 7-12 Board attributes
Attribute
Description
Board name silkscreen
1x100GE-CFP2
Description
1-Port 100GBase-CFP2 Physical Interface Card(PIC)
BOM
03032AMN
Model
CR5D00E1NC79
Table 7-13 Mapping products and versions
Product
Slot ID
Earliest Software
Version