Huawei NE40E-M2 Series - Page 64

7 Boards
Issue ()
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
62
Technical Specifications
Table 7-22 Interface specifications
Attribute
Description
Optical type supported

8.14 10Gbps SFP+ Optical Module

8.15 10Gbps SFP+ CWDM Optical Module

8.16 10Gbps SFP+ BIDI Optical Module

8.17 10Gbps SFP+ DWDM Optical Module

8.13 1.25/9.953/10.3125Gbps SFP+ Optical Module

8.9 1.25Gbps eSFP Optical Module

8.11 1.25Gbps eSFP CWDM Optical Module

8.10 1.25Gbps eSFP BIDI Optical Module

8.12 125M~2.67Gbps eSFP DWDM Optical Module
Working mode
Full-duplex
Compliant standard
IEEE 802.3
Frame format
Ethernet_II, Ethernet_SAP, and Ethernet_SNAP
Table 7-23 Board specifications
Item
Specification
Dimensions (H x W x D)
19.8mm x 193.8mm x 209.3 mm (0.78 in. x 7.63 in. x 8.24
in.)
Typical power
consumption
58.8 W
Typical heat dissipation
190.8 BTU/hour
Weight
0.6 kg (1.32 lb)
Ambient temperature
Long terms: 0 °C to 45 °C (32°F to 113°F) Short terms:
-5 °C to 55 °C (23°F to 131°F)
7.1.5 Bidirectional 1-Channel CWDM Optical Add/Drop
Multiplexing (1471nm) Physical Interface Card(PIC)
Overview
Table 7-24 Board attributes
Attribute
Description