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IBM BladeCenter HS22 User Manual

IBM BladeCenter HS22
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The following table is a summary of the features and specifications of the blade
server.
Table 1. Features and specifications
Microprocessor: Supports up to two
multi-core Intel Xeon microprocessors.
Note: Use the Setup utility to
determine the type and speed of the
microprocessors in the blade server.
Memory:
v 12 dual inline memory module
(DIMM) connectors
v Type: Very Low Profile (VLP)
double-data rate (DDR3) DRAM.
Supports 1 GB, 2 GB, 4 GB, 8 GB,
and 16 GB DIMMs with up to 192
GB of total memory on the system
board
Integrated functions:
v Horizontal-compact-form-factor
(CFFh) expansion card interface
v Vertical-combination-I/O (CIOv)
expansion card interface
v Local service processor: Integrated
Management Module (IMM) with
Intelligent Platform Management
Interface (IPMI) firmware
v Integrated Matrox G200eV video
controller
v LSI 1064E SAS controller
v Broadcom BCM5709S dual-port
Gigabit Ethernet controller
v Integrated keyboard/video/mouse
(cKVM) controller through IMM
v Light path diagnostics
v RS-485 interface for communication
with the management module
v Automatic server restart (ASR)
v USB 2.0 for communication with
cKVM and removable media drives
(an external USB port is not
supported)
v Serial over LAN (SOL)
v Redundant buses for
communication with keyboard,
mouse, and removable media
drives
Predictive Failure Analysis (PFA)
alerts:
v Microprocessors
v Memory
v Storage drives
Electrical input: 12Vdc
Environment:
v Air temperature:
Blade server on: 10°C to 35°C
(50°F to 95°F). Altitude:0mto
914.4 m (0 ft to 3000 ft)
Blade server on: 10°C to 32°C
(50°F to 89.6°F). Altitude: 914.4
m to 2133.6 m (3000 ft to 7000
ft)
Blade server off: 10°C to 43°C
(50°F to 109.4°F). Altitude: 914.4
m to 2133.6 m (3000 ft to 7000
ft)
Blade server shipping: -40°C to
60°C (-40°F to 140°F)
v Humidity:
Blade server on: 8% to 80%
Blade server off: 8% to 80%
Blade server storage: 5% to 80%
Blade server shipment: 5% to
100%
v Particulate contamination:
Attention: Airborne particulates
and reactive gases acting alone or
in combination with other
environmental factors such as
humidity or temperature might
pose a risk to the server. For
information about the limits for
particulates and gases, see
“Particulate contamination” on
page 81.
Drives: Supports up to two hot-swap,
small form factor (SFF) Serial Attached
SCSI (SAS) or Serial ATA (SATA)
storage drives
Size:
v Height: 24.5 cm (9.7 inches) (6U)
v Depth: 44.6 cm (17.6 inches)
v Width: 2.9 cm (1.14 inches)
v Maximum weight: 4.8 kg (10 lb)
NEBS Environment
v Air temperature:
Blade server on: 5°C to 40°C (41°F
to 104°F). Altitude: -60 m to 1800
m (-197 ft to 6000 ft)
Blade server on: 5°C to 30°C (41°F
to 86°F). Altitude: 1800 m to 4000
m (6000 ft to 13000 ft)
Blade server off: -5°C to 55°C
(23°F to 131°F). Altitude: -60 m to
1800 m (-197 ft to 6000 ft)
Blade server off: -5°C to 45°C
(23°F to 113°F). Altitude: 1800 m
to 4000 m (6000 ft to 13000 ft)
Blade server storage: -40°C to
60°C (-40°F to 140°F)
v Humidity: 8% to 85%
v Particulate contamination:
Attention: Airborne particulates
and reactive gases acting alone or in
combination with other
environmental factors such as
humidity or temperature might pose
a risk to the server. For information
about the limits for particulates and
gases, see “Particulate
contamination” on page 81.
8 BladeCenter HS22 Type 7870 and 1936: Installation and User's Guide

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IBM BladeCenter HS22 Specifications

General IconGeneral
Tcase76.2 °C
Bus typeQPI
SteppingB1
FSB ParityNo
Processor codeSLBZ8
Processor cache12 MB
Processor cores6
Processor modelE5649
System bus rate5.86 GT/s
Processor seriesIntel Xeon 5600 Series
Processor socketSocket B (LGA 1366)
Processor threads12
Processor codenameWestmere EP
Processor frequency2.53 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor package size42.5 X 45 mm
Processor front side bus1333 MHz
Processor boost frequency2.93 GHz
Processor operating modes64-bit
ECC supported by processorYes
Supported instruction setsSSE4.2
Thermal Design Power (TDP)80 W
Compatible processor seriesIntel® Xeon®
Number of processors installed1
CPU multiplier (bus/core ratio)19
Maximum number of SMP processors2
Physical Address Extension (PAE)40 bit
Memory types supported by processorDDR3 800/1066/1333
Memory channels supported by processorTriple
Memory bandwidth supported by processor (max)32 GB/s
Maximum internal memory supported by processor288 GB
HDD size2.5 \
RAID levels0, 1
HDD interfaceSerial Attached SCSI (SAS)
Total storage capacity0 GB
Maximum storage capacity1 TB
Number of HDDs installed0
Internal memory12 GB
Memory clock speed- MHz
Internal memory typeDDR3-SDRAM
Maximum internal memory192 GB
Memory layout (slots x size)3 x 4 GB
Graphics cardG200eV
Graphics card memory typeGDDR2
Networking featuresGigabit Ethernet
PS/2 ports quantity-
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Compatible operating systemsMicrosoft Windows RedHat, SUSE, VMware Oracle Solaris
Chassis typeRack (1U)
Processor ARK ID52581
Intel® Turbo Boost Technology1.0
Weight and Dimensions IconWeight and Dimensions
Depth446 mm
Width245 mm
Height29 mm
Weight5400 g

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