IBM System x3500 M4 - Locations of Key Components and Connectors

IBM System x3500 M4 4
Low-voltage Intel Xeon processors draw less energy to satisfy demands of power and thermally
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constrained data centers and telecommunication environments.
Low-voltage 1.35 V DDR3 memory RDIMMs consume 15% less energy than 1.5 V DDR3 RDIMMs.
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The server uses hexagonal ventilation holes, a part of IBM Calibrated Vectored Cooling™ technology.
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Hexagonal holes can be grouped more densely than round holes, providing more efficient airflow
through the system.
IBM Systems Director Active Energy Manager™ provides advanced data center power notification and
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management to help achieve lower heat output and reduced cooling needs.
Locations of key components and connectors
Figure 2 shows the front of the server.
Figure 2. Front view of the IBM System x3500 M4