Intel 945G - Figure 5 Thermal Solution Performance; Figure 6 Typical 1 U Server Motherboard Component Placement

Intel
®
945G Express Chipset GMCH Thermal Design Guide
Reference Thermal Solution
Figure 5 Thermal Solution Performance
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
0 50 100 150 200 250 300 350 400 450 500 550 600
Airflow (LFM)
Thermal Characterization Parameter,
Ψ
(°C/W)
Sink-to-Ambient
Case-to-Ambient
Figure 6 Typical 1U Server Motherboard Component Placement
Caution: Heat sink orientation alone does not guarantee that 200 lfm (1.02 m/s) airflow speed will be
achieved. The system integrator should use analytical or experimental means to determine
whether a system design provides adequate airflow speed for a particular GMCH heat sink.
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