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Intel E7500 MCH User Manual

Intel E7500 MCH
34 pages
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Intel
®
E7500 and Intel
®
E7501
Chipsets MCH
Thermal Design Guide for Embedded Applications
March 2003
Order Number: 273819-002

Table of Contents

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Intel E7500 MCH Specifications

General IconGeneral
ManufacturerIntel
ModelE7500 MCH
ECC SupportYes
TypeMemory Controller Hub
FSB Speed400 MHz
Memory Types SupportedDDR
Memory ChannelsDual

Summary

Thermal Simulation

Thermal Specifications

Power Specifications (TDP)

Lists Thermal Design Power (TDP) for different MCH configurations.

Die Temperature Limits

Specifies maximum allowed die temperatures (Tdie-hs) for reliable operation.

Thermal Metrology

Die Temperature Measurement Methodologies

Describes techniques for accurate die temperature measurement, including 90° and 0° methods.

Power Simulation Software

Reference Thermal Solution

Operating Environment and Thermal Performance

Details the design assumptions and performance criteria for the reference solution.

Mechanical Design Envelope

Thermal Solution Assembly

Retention Method A

Details clip, anchors, orientation, and keep-out dimensions for Method A.

Retention Method B

Details push-pins, orientation, and keep-out dimensions for Method B.

Reliability Requirements

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