Home
Intel
Controller
E7500 MCH
Intel E7500 MCH User Manual
4
of 1
of 1 rating
34 pages
Give review
Manual
Specs
To Next Page
To Next Page
Loading...
Intel
®
E7500
and
Intel
®
E
7501
Chipsets MCH
The
rma
l Desig
n Gu
ide fo
r E
mbe
dded Ap
plica
tio
ns
Ma
rch 2003
Order Number
: 273819-
002
2
Table of Contents
Default Chapter
3
Table of Contents
3
Introduction
5
Document Goals
5
Document Scope
5
Design Flow
5
Thermal Design Process
5
Definition of Terms
6
Reference Documents
6
Packaging Technology
7
Intel ® E7500 and Intel ® E7501 Chipsets MCH Package Dimensions
7
Thermal Simulation
9
Thermal Specifications
11
Power
11
Die Temperature
11
Intel ® E7500 and Intel ® E7501 Chipsets MCH Thermal Specifications
11
Thermal Metrology
13
Die Temperature Measurements
13
90° Angle Attach Methodology
13
0° Angle Attach Methodology
14
90° Angle Attach Methodology
14
0° Angle Attach Methodology
15
0° Angle Attach Heat Sink Modifications
15
Power Simulation Software
16
Thermal Solution Decision Flowchart
16
Reference Thermal Solution
17
Operating Environment and Thermal Performance
17
Theta Ja Required Versus Device and Configuration
17
Mechanical Design Envelope
18
Theta Ja Versus Airflow for the Reference Thermal Solution
18
Thermal Solution Assembly
19
Reference Heat Sink Volumetric Envelope for the MCH
19
Retention Method a
20
Heat Sink Orientations
20
Board Level Keep-Out Dimensions
20
Reference Thermal Solution Assembly Using Retention Method a
20
Heat Sink Retention Mechanism Layout for Retention Method a
21
Retention Mechanism Component Keep-Out Zones for Retention Method a
21
Heat Sink Clip
22
Solder-Down Anchors
22
Retention Method B
22
Reference Thermal Solution Assembly Using Retention Method B
22
Heat Sink Orientations
23
Board Level Keep-Out Dimensions
23
Board Component Keep-Out for Retention Method B
23
Heat Sink Push-Pin
24
Mechanical Interface Material
24
Thermal Interface Material
24
Heat Sink Mechanical Gasket, Optional Two-Piece
24
Reliability Requirements
25
Conclusion
27
Thermal Solution Component Suppliers
29
Extruded Pin Fin Heat Sink
29
Materials for Retention Method a
29
Materials for Retention Method B
29
Attach Hardware
30
A.4 Attach Hardware
30
Mechanical Drawings
31
Mechanical Drawing List
31
MCH Heat Sink
32
Heat Sink Clip
33
Push-Pin
34
4
Based on 1 rating
Ask a question
Give review
Questions and Answers:
Need help?
Do you have a question about the Intel E7500 MCH and is the answer not in the manual?
Ask a question
Intel E7500 MCH Specifications
General
Manufacturer
Intel
Model
E7500 MCH
ECC Support
Yes
Type
Memory Controller Hub
FSB Speed
400 MHz
Memory Types Supported
DDR
Memory Channels
Dual
Related product manuals
Intel 4 Series
44 pages
Intel U3-1
185 pages
6 SERIES CHIPSET - DATASHEET 01-2011
936 pages
Need help?
General
To Next Page
