Intel E7500 MCH User Manual

Thermal Design Guide 3
Contents
Contents
1.0 Introduction....................................................................................................................................5
1.1 Document Goals...................................................................................................................5
1.2 Document Scope ..................................................................................................................5
1.3 Design Flow..........................................................................................................................5
1.4 Definition of Terms................................................................................................................6
1.5 Reference Documents..........................................................................................................6
2.0 Packaging Technology .................................................................................................................7
3.0 Thermal Simulation .......................................................................................................................9
4.0 Thermal Specifications ...............................................................................................................11
4.1 Power..................................................................................................................................11
4.2 Die Temperature.................................................................................................................11
5.0 Thermal Metrology ......................................................................................................................13
5.1 Die Temperature Measurements........................................................................................13
5.1.1 90° Angle Attach Methodology ..............................................................................13
5.1.2 0° Angle Attach Methodology ................................................................................14
5.2 Power Simulation Software.................................................................................................16
6.0 Reference Thermal Solution.......................................................................................................17
6.1 Operating Environment and Thermal Performance ............................................................17
6.2 Mechanical Design Envelope .............................................................................................18
6.3 Thermal Solution Assembly................................................................................................19
6.3.1 Retention Method A ...............................................................................................20
6.3.1.1 Heat Sink Orientations...........................................................................20
6.3.1.2 Board Level Keep-out Dimensions ........................................................20
6.3.1.3 Heat Sink Clip ........................................................................................22
6.3.1.4 Solder-Down Anchors............................................................................22
6.3.2 Retention Method B ...............................................................................................22
6.3.2.1 Heat Sink Orientations...........................................................................23
6.3.2.2 Board Level Keep-Out Dimensions........................................................23
6.3.2.3 Heat Sink Push-Pin................................................................................24
6.3.3 Mechanical Interface Material................................................................................24
6.3.4 Thermal Interface Material.....................................................................................24
6.4 Reliability Requirements .....................................................................................................25
7.0 Conclusion...................................................................................................................................27
A Thermal Solution Component Suppliers...................................................................................29
A.1 Extruded Pin Fin Heat Sink.........................................................................................................29
A.2 Materials for Retention Method A ...............................................................................................29
A.3 Materials for Retention Method B ...............................................................................................29
A.4 Attach Hardware.........................................................................................................................30
B Mechanical Drawings..................................................................................................................31

Intel E7500 MCH Specifications

General

Manufacturer	Intel
Model	E7500 MCH
ECC Support	Yes
Type	Memory Controller Hub
FSB Speed	400 MHz
Memory Types Supported	DDR
Memory Channels	Dual