Intel
®
E7500 and Intel
®
E7501 Chipsets MCH Thermal Design Guide
Thermal Design Guide 29
Appendix A Thermal Solution Component Suppliers
A.1 Extruded Pin Fin Heat Sink
A.2 Materials for Retention Method A
A.3 Materials for Retention Method B
Part Supplier (Part Number) Contact Information
Pin Fin Heat Sink
(Includes heat sink and attached
thermal interface material)
CoolerMaster (ECB-00028-01)
Wendy Lin
886-2-3434-0050, x333
wendy@coolermaster.com.tw
Part
Qty Required
(per assy)
Intel Part
Number
Supplier Contact Information
Heatsink Clip 1 A69230-001
CCI/ACK
Harry Lin
714-739-5797
hlinack@aol.com
Foxconn
Bob Hall
503-693-3509 x235
bhall@foxconn.com
Board Mount Solder-Down Anchors
(Two anchors required per heat sink.)
2 A13494-005 Foxconn
Julia Jiang
(408) 919-6178
juliaj@foxconn.com
Part Supplier (Part Number) Contact Information
Push-Pin Peninsula Components (PL 1674)
Steve Blank
(562) 694-4477
steve@pencomsf.com
NOTE: Four push-pins are required per heat sink.