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E7500 MCH
Intel E7500 MCH User Manual
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In
te
l
®
E7500 and Intel
®
E7501 Chip
sets
M
CH Thermal Design Gu
ide
Therma
l Design Gui
de
15
Figure
4
shows the 0° an
gle attac
h
me
thodology
.
Figure
5
shows the 0° an
gle attac
h
hea
t s
ink mo
dificati
ons.
Fig
ure 4.
0
° Angl
e At
t
ac
h Meth
od
olog
y
NOTE:
Dr
awing
repr
esen
ts t
he to
p view
and i
s not
to sc
ale
.
Figure 5.
0° Angle Att
ach Heat Sink Modifications
NOTE:
Dr
awing
d
imen
sions
are n
ot to
scale
.
14
16
Table of Contents
Default Chapter
3
Table of Contents
3
Introduction
5
Document Goals
5
Document Scope
5
Design Flow
5
Thermal Design Process
5
Definition of Terms
6
Reference Documents
6
Packaging Technology
7
Intel ® E7500 and Intel ® E7501 Chipsets MCH Package Dimensions
7
Thermal Simulation
9
Thermal Specifications
11
Power
11
Die Temperature
11
Intel ® E7500 and Intel ® E7501 Chipsets MCH Thermal Specifications
11
Thermal Metrology
13
Die Temperature Measurements
13
90° Angle Attach Methodology
13
0° Angle Attach Methodology
14
90° Angle Attach Methodology
14
0° Angle Attach Methodology
15
0° Angle Attach Heat Sink Modifications
15
Power Simulation Software
16
Thermal Solution Decision Flowchart
16
Reference Thermal Solution
17
Operating Environment and Thermal Performance
17
Theta Ja Required Versus Device and Configuration
17
Mechanical Design Envelope
18
Theta Ja Versus Airflow for the Reference Thermal Solution
18
Thermal Solution Assembly
19
Reference Heat Sink Volumetric Envelope for the MCH
19
Retention Method a
20
Heat Sink Orientations
20
Board Level Keep-Out Dimensions
20
Reference Thermal Solution Assembly Using Retention Method a
20
Heat Sink Retention Mechanism Layout for Retention Method a
21
Retention Mechanism Component Keep-Out Zones for Retention Method a
21
Heat Sink Clip
22
Solder-Down Anchors
22
Retention Method B
22
Reference Thermal Solution Assembly Using Retention Method B
22
Heat Sink Orientations
23
Board Level Keep-Out Dimensions
23
Board Component Keep-Out for Retention Method B
23
Heat Sink Push-Pin
24
Mechanical Interface Material
24
Thermal Interface Material
24
Heat Sink Mechanical Gasket, Optional Two-Piece
24
Reliability Requirements
25
Conclusion
27
Thermal Solution Component Suppliers
29
Extruded Pin Fin Heat Sink
29
Materials for Retention Method a
29
Materials for Retention Method B
29
Attach Hardware
30
A.4 Attach Hardware
30
Mechanical Drawings
31
Mechanical Drawing List
31
MCH Heat Sink
32
Heat Sink Clip
33
Push-Pin
34
4
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Intel E7500 MCH Specifications
General
Brand
Intel
Model
E7500 MCH
Category
Controller
Language
English
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