Intel E7500 MCH - 0° Angle Attach Methodology; 0° Angle Attach Heat Sink Modifications

Intel
®
E7500 and Intel
®
E7501 Chipsets MCH Thermal Design Guide
Thermal Design Guide 15
Figure 4 shows the 0° angle attach methodology.
Figure 5 shows the 0° angle attach heat sink modifications.
Figure 4. 0° Angle Attach Methodology
NOTE: Drawing represents the top view and is not to scale.
Figure 5. 0° Angle Attach Heat Sink Modifications
NOTE: Drawing dimensions are not to scale.