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General| Chipset Series | Intel 4 Series |
|---|---|
| Process Technology | 65nm |
| Memory Type | DDR2, DDR3 |
| SATA Ports | 6 |
| USB Ports | 12 |
| RAID Support | Yes (ICH10R) |
| Southbridge | ICH10, ICH10R |
| FSB | 800/1066/1333 MHz |
| DirectX Support | DirectX 10 (on integrated graphics variants) |
| SATA Revision | 2.0 |
| Chipset Variants | G41, G43, G45, P43, P45 |
| PCI Express Lanes | 16 |
| Max Memory | 16 GB |
| Integrated Graphics | Intel GMA X4500 (G41, G43, G45) |
Outlines the required case temperature limits for proper operation and reliability.
Defines Thermal Design Power (TDP) as estimated power dissipation for thermal solution design.
Details thermal specifications like TDP, idle power, TC-MIN, and TC-MAX for various chipsets.
Defines operating environment boundary conditions typical for ATX and BTX form factors.
Details boundary conditions for ATX platforms, including TDP, airflow, and ambient temperature.
Outlines operating environment conditions for BTX platforms, focusing on processor thermal module airflow.
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