Reference Thermal Solution
Thermal and Mechanical Design Guidelines 30
Table 6. Balanced Technology Extended (BTX) Reference Thermal Solution
Environmental Reliability Requirements (System Level)
Test
1
Requirement Pass/Fail
Criteria
2
Mechanical
Shock
• 3 drops for + and - directions in each of 3
perpendicular axes (i.e., total 18 drops).
• Profile: 25g, Trapezoidal waveform, 5.7 m/s
[225 in/sec] minimum velocity change.
Visual\Electrical
Check
Random
Vibration
• Duration: 10 min/axis, 3 axes
• Frequency Range: 0.001 g2/Hz @ 5Hz ramping to
0.01 g2/Hz @20 Hz, 0.01 g2/Hz @ 20 Hz to 500 Hz
• Power Spectral Density (PSD) Profile: 2.20 g RMS
Visual/Electrical
Check
Thermal
Cycling
• Non-Operating, -40 °C to +70 °C Thermal
Performance
Humidity • 85 % relative humidity / 55 °C Visual Check
NOTES:
1. The above tests should be performed on a sample size of at least 12 assemblies from 3
different lots of material.
2. Additional Pass/Fail Criteria may be added at the discretion of the user.
3. Mechanical Shock minimum velocity change is based on a system weight of 20 to 29
lbs.
4. For the chassis level testing the system will include: 1 HD, 1 ODD, 1 PSU, 2 DIMMs and
the I/O shield.
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