Mechanical Drawings
36
Thermal and Mechanical Design Guide
Figure 16. (G)MCH Component Keep-Out Restrictions for Balanced Technology Extended (BTX) Platforms
13
4
5678
B
C
D
A
12345678
B
C
D
A
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
51.4
2.024[]
61.98
2.440[]
55.88
2.200[]
48.26
1.900[]
4X 8.76
.345[]
4X 5.08
.200[]
4X 4.19
.165[]
4X 2.095
.082[]
2X 3.3
.130[]
2X 2.29
.090[]
2X 5.72
.225[]
2X 2.54
.100[]
44
1.732[]
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 4
0.4D24866 D
REVDRAWING NUMBERCAGE CODE
SIZE
BROADWATER BTX KEEP OUT ZONE
TITLE
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
CORP.
R
TMI
DEPARTMENT
NA
FINISH:
NA
MATERIAL:
mm/dd/yyDANA GRINDLE
DATEAPPROVED BY
mm/dd/yyX
DATECHECKED BY
06/01/05KG TAN
DATEDRAWN BY
mm/dd/yyKG TAN
DATEDESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
LINEAR TOL 0.1
THIRD ANGLE PROJECTION
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPROVED
*** 0.1 PRELIMINARY RELEASE mm/dd/yy X
B6,C6 0.4 CHANGE MAX COMP HEIGHT FROM 1.27MM TO 1.55MM 06/24/05
D24866 1 0.4
DWG. NO SHT. REV
PARTS LIST
DESCRIPTIONPART NUMBER
ITEM NO
QTY PER ASSY
-001-002-003
D24866TOP
COMPONENT CENTER
MAX 1.27 [.050]
COMPONENT HEIGHT
(NON-MCH COMPONENTS)
NO COMPONENTS THIS AREA
NOTES:
1 HOLE PLACEMENT FABRICATION
TOLERANCE PER INTEL 454979, CLASS 1,2,3
2. HEATSINK COMPONENT HEIGHT NOT TO EXCEED
34.3MM ABOVE MOTHERBOARD SURFACE.
MAX 1.78 [.070] COMPONENT HEIGHT
MAX 1.55 [.060]
COMPONENT HEIGHT
(NON-MCH COMPONENTS)
SEE DETAIL A
SEE DETAIL B
DETAIL A
SCALE 8
4X D PLATED THRU HOLE
4X 1.42[.056] TRACE KEEPOUT
DETAIL B
SCALE 6
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