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Intel 4 Series User Manual
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Thermal Metrology
Thermal and Mechanical Design Guidelines
18
Figure 4. 0° Angle Attach Methodology (top view, not to scale)
Figure 5. 0° Angle Attach Heatsink Modifi
cations (generic heatsink side and bottom
view shown, not to scale)
17
19
Table of Contents
Default Chapter
3
Table of Contents
3
1 Introduction
7
Terminology
8
Reference Documents
9
2 Product Specifications
11
Package Description
11
Non-Grid Array Package Ball Placement
11
Figure 1. (G)MCH Non-Grid Array
11
Package Loading Specifications
12
Thermal Specifications
12
Figure 2. Package Height
12
Table 1. Package Loading Specifications
12
TDP Prediction Methodology
13
Pre-Silicon
13
Post-Silicon
13
Thermal Design Power (TDP)
13
Definition
13
Table 2. Thermal Specifications
14
Thermal Specifications
14
Non-Critical to Function Solder Balls
15
TCONTROL Limit
15
Figure 3. Non-Critical to Function Solder Balls
15
3 Thermal Metrology
17
Case Temperature Measurements
17
Thermocouple Attach Methodology
17
Figure 4. 0° Angle Attach Methodology (Top View, Not to Scale)
18
Figure 5. 0° Angle Attach Heatsink Modifications
18
Airflow Characterization
19
Figure 6. Airflow &Temperature Measurement Locations
19
4 Reference Thermal Solution
21
Operating Environment
22
Figure 7. Cross-Cut Dimension Change of PWSHS Reference Design
22
ATX Form Factor Operating Environment
23
Table 3. (G)MCH Heatsink Boundary Condition Summary in ATX Platforms
23
Figure 8. ATX Boundary Conditions
24
Figure 10. Processor Heatsink Orientation to Provide Airflow to (G)MCH
25
Figure 9. Side View of ATX Boundary Conditions
25
Balanced Technology Extended (BTX) Form Factor Operating Environment
26
Table 4. (G)MCH Heatsink Boundary Condition Summary in BTX Platforms
26
Reference Design Mechanical Envelope
27
Thermal Solution Assembly
27
Figure 11. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a Balanced Technology Extended (BTX) Platform
27
Figure 12. Design Concept for ATX (G)MCH Heatsink - Installed on Board
28
Figure 13. Design Concept for Balanced Technology Extended (BTX) (G)MCH
28
Environmental Reliability Requirements
29
Table 5. ATX Reference Thermal Solution Environmental Reliability Requirements
29
Table 6. Balanced Technology Extended (BTX) Reference Thermal Solution Environmental Reliability Requirements (System Level)
30
Appendix A Enabled Suppliers
31
Table 7. ATX Intel Reference Heatsink Enabled Suppliers for (G)MCH
31
Table 8. BTX Intel Reference Heatsink Enabled Suppliers for (G)MCH
31
Table 9. Supplier Contact Information
32
Appendix B Mechanical Drawings
33
Figure 14. (G)MCH Package Drawing
34
Figure 15. (G)MCH Component Keep-Out Restrictions for ATX Platforms
35
Figure 16. (G)MCH Component Keep-Out Restrictions for Balanced Technology Extended (BTX) Platforms
36
Figure 17. (G)MCH Reference Heatsink for ATX Platforms - Sheet 1
37
Figure 18. (G)MCH Reference Heatsink for ATX Platforms - Sheet 2
38
Figure 19. (G)MCH Reference Heatsink for ATX Platforms - Anchor
39
Figure 20. (G)MCH Reference Heatsink for ATX Platforms - Ramp Retainer Sheet 1
42
Figure 24. (G)MCH Chipsets Reference Heatsink for Balanced Technology Extended (BTX) Platforms - Clip
44
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Intel 4 Series Specifications
General
Brand
Intel
Model
4 Series
Category
Controller
Language
English
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