Introduction
Thermal and Mechanical Design Guidelines 8
1.1 Terminology
Term Description
FC-BGA Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a
die is mounted using an underfill C4 (Controlled Collapse Chip Connection)
attach style. The primary electrical interface is an array of solder balls attached
to the substrate opposite the die. Note that the device arrives at the customer
with solder balls attached.
Intel
®
ICH7 Intel
®
I/O Controller Hub 7. The chipset component that contains the primary
PCI interface, LPC interface, USB2, SATA, and/or other legacy functions.
Intel
®
ICH10 Intel
®
I/O Controller Hub 10. The chipset component that contains the primary
PCI interface, LPC interface, HDA interface, USB2, SATA, and/or other legacy
functions.
GMCH Graphic Memory Controller Hub. The chipset component that contains the
processor and memory interface and integrated graphics core.
T
A
The local ambient air temperature at the component of interest. The ambient
temperature should be measured just upstream of airflow for a passive
heatsink or at the fan inlet for an active heatsink.
T
C
The case temperature of the (G)MCH component. The measurement is made at
the geometric center of the die.
T
C-MAX
The maximum value of T
C
.
T
C-MIN
The minimum valued of T
C
.
TDP Thermal Design Power is specified as the maximum sustainable power to be
dissipated by the (G)MCH. This is based on extrapolations in both hardware and
software technology. Thermal solutions should be designed to TDP.
TIM Thermal Interface Material: thermally conductive material installed between two
surfaces to improve heat transfer and reduce interface contact resistance.
Ψ
CA
Case-to-ambient thermal solution characterization parameter (Psi). A measure
of thermal solution performance using total package power. Defined as (T
C
–
T
A
) / Total Package Power. Heat source size should always be specified for Ψ
measurements.
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