Intel 4 Series User Manual

3 Thermal and Mechanical Design Guidelines
Contents
1 Introduction.....................................................................................................7
1.1 Terminology ..........................................................................................8
1.2 Reference Documents.............................................................................9
2 Product Specifications......................................................................................11
2.1 Package Description..............................................................................11
2.1.1 Non-Grid Array Package Ball Placement......................................11
2.2 Package Loading Specifications...............................................................12
2.3 Thermal Specifications ..........................................................................12
2.3.1 Thermal Design Power (TDP) ....................................................13
2.3.1.1 Definition ................................................................13
2.3.2 TDP Prediction Methodology......................................................13
2.3.2.1 Pre-Silicon...............................................................13
2.3.2.2 Post-Silicon..............................................................13
2.3.3 Thermal Specifications .............................................................14
2.3.4 T
CONTROL
Limit..........................................................................15
2.4 Non-Critical to Function Solder Balls........................................................15
3 Thermal Metrology..........................................................................................17
3.1 Case Temperature Measurements...........................................................17
3.1.1 Thermocouple Attach Methodology.............................................17
3.2 Airflow Characterization ........................................................................19
4 Reference Thermal Solution..............................................................................21
4.1 Operating Environment .........................................................................22
4.1.1 ATX Form Factor Operating Environment ....................................23
4.1.2 Balanced Technology Extended (BTX) Form Factor Operating
Environment...........................................................................
26
4.2 Reference Design Mechanical Envelope....................................................27
4.3 Thermal Solution Assembly....................................................................27
4.4 Environmental Reliability Requirements...................................................29
Appendix A Enabled Suppliers ...........................................................................................31
Appendix B Mechanical Drawings.......................................................................................33

Intel 4 Series Specifications

General

Chipset Series	Intel 4 Series
Process Technology	65nm
Memory Type	DDR2, DDR3
SATA Ports	6
USB Ports	12
RAID Support	Yes (ICH10R)
Southbridge	ICH10, ICH10R
FSB	800/1066/1333 MHz
DirectX Support	DirectX 10 (on integrated graphics variants)
SATA Revision	2.0
Chipset Variants	G41, G43, G45, P43, P45
PCI Express Lanes	16
Max Memory	16 GB
Integrated Graphics	Intel GMA X4500 (G41, G43, G45)